Orbbec, a unicorn startup headquartered in Shenzhen of China and dedicated to 3D sensing technology development, has the world’s third-largest number of patents related to 3D sensing, according to Taipei-based government-backed IT research institute MIC (Market Intelligence& Consulting Institute) of III (Institute for Information Industry).
“In 2015, Orbbec unveiled its first ASIC chip. Thanks to the explosive growth of the mobile device market, Orbbec’s product and market presence increased significantly in 2017. If Orbbec started a few years later, the company would have missed out on its best chance in the market,” said Aaron Lin, senior industry analyst at MIC.
"With 1.5 billion units shipped worldwide every year, smartphones have been the main driving force behind the growth of the consumer market. And applying 3D facial recognition technology in mobile devices gave Orbbec a head start on the commercialization of its technology and helped it make its way into the unicorn list.”
