Panasonic Corporation announced that it has commercialized a granular semiconductor encapsulation material designed specifically for fan-out wafer-level package (FOWLP) and panel level packaging (PLP). Sample production is scheduled to start in September 2018. These new products will increase the productivity of these leading-edge semiconductor packages for wearable and mobile devices and reduce their manufacturing costs.
Panasonic noted that leading-edge semiconductor packages (FOWLP, PLP, FOSiP, WLCSP, etc.) for radio frequency (RF) and power management ICs used in wearable electronics, mobile devices and other high functionality electronic devices. Series X851C is designed for chip-first packages and X851D is designed for chip-last package.
Panasonic has developed a portfolio of semiconductor encapsulation materials for FOWLP and PLP. In addition to the newly commercialized granular epoxy mold compounds, Panasonic also offers sheet-format encapsulants (suitable for encapsulation thicknesses of 200 μm or less), as well as liquid encapsulation products.
By combining low warpage with high flow, this material improves the semiconductor package process productivity. In addition, the material has excellent adhesion to the redistribution layer (RDL) is integral to enabling a variety of package designs.
These new products will be on display in the Panasonic Electronic Materials booth at SEMICON Taiwan 2018, which will be held at the Taipei Nangong Exhibition Center from September 5 to 7, 2018.
