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討論 新聞 主題﹕Intel助力!台北市府轉運站數位電子看板上身
Intel在數位電子看板的動作頻頻!繼年初與微軟合作開發高端應用的數位電子看板之外,上周並與數位看板業者C2 Networks在台北市市府轉運站打造創意空間,強調引進歐洲與日本櫥窗流行,以Spectacular Wall方式,將多塊LCD組合排列完整影像,拼接製造立體互效果,並支援遠端管理系統以達到降低成本之效...

wangjulun
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發 表 於: 2010.08.03 09:40:04 AM
文章主題: Intel助力!台北市府轉運站數位電子看板上身
應該是AMT而不是ATM吧?
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訪客

 

文章:

發 表 於: 2010.08.03 10:03:30 AM
文章主題: Re: Intel助力!台北市府轉運站數位電子看板上身
您好~已更正,感謝您的悉心指教。
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Adam Chen
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發 表 於: 2010.08.03 10:37:41 AM
文章主題: Re: Intel助力!台北市府轉運站數位電子看板上身
綠能+創意是不錯的科技發展方向,但市府的另一大建設:花博,把原本的大片綠草地,重新舖設大片水泥磚走道,並將老樹移植...等並非好設計.
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Only Chen
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發 表 於: 2010.08.17 11:25:44 AM
文章主題: Re: Intel助力!台北市府轉運站數位電子看板上身

Intel也看上未來數位家電晶片市場?

===================================================================

Intel buys Texas Instruments' cable modem unit

NEW YORK (CNNMoney.com) -- Intel will buy Texas Instruments' cable modem product line, the company said Monday.

The deal should close in the fourth quarter of 2010, Intel said in a statement. Further terms of the acquisition, including the cost, were not disclosed.

The move is part of Intel's continued effort to sell its computer chips to the cable industry and to other consumer electronics sectors. The so-called "system-on-chip" products will be based on Intel's Atom processors.

Intel (INTC, Fortune 500) wants those products to be available on set top boxes, digital TVs, Blu-Ray players and other devices.

Texas Instruments' (TI) cable modem unit will become part of Intel's Digital Home Group. Intel said all affected TI employees have been offered jobs at Intel sites in their home countries, primarily Israel.

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Tommy Chung
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發 表 於: 2010.08.18 11:50:03 AM
文章主題: Re: Intel助力!台北市府轉運站數位電子看板上身

Intel's 'Sandy Bridge' to use new specialized silicon

Intel's upcoming Sandy Bridge processors will include new circuits for handling demanding multimedia tasks, according to sources, more evidence of processor changes in store as the chip giant gets ready to shift over to a new processor architecture.

Sandy Bridge is Intel's next microarchitecture, or redesign, of its processors--which the chipmaker does every two years. The current design, Nehalem, was introduced in November 2008 and is used in all Core i3, i5, and i7 processors, which now populate the newest PCs worldwide. Sandy Bridge chips are scheduled to go into commercial production in the fourth quarter, and the first PCs are expected before or during the January 2011 Consumer Electronics Show.

For the first time on any Intel chip, Sandy Bridge will include silicon dedicated to handling the transcoding, or converting, of data from one format to another. The transcoding circuits will be separate from the main processor and the on-chip graphics function, according to sources at system makers.

Sandy Bridge's basic layout.

Sandy Bridge's basic layout.

(Credit: Intel)

Transcoding, for instance, converts a movie on a PC to a format that makes it viewable on an iPhone or iPod. More generally, transcoding is used whenever a movie or audio clip is transferred from a camera to a computer. Sandy Bridge will excel at this task, compared with current Core i series chips, sources said.

Sandy Bridge, like Nehalem, is a big step for Intel. It will be the first mainstream Intel chip to integrate the graphics function, or GPU, onto the same piece of silicon as the main processor, or CPU. This is possible courtesy of Intel's latest and greatest 32-nanometer manufacturing technology.

Sandy Bridge will also include new instructions for handling multimedia tasks. Called Advanced Vector Extension (Intel AVX) instructions, they will assist in accelerating a host of multimedia tasks, including video and audio processing.

During Intel's second-quarter conference call last month, CEO Paul Otellini said the company is moving quickly to Sandy Bridge. "Due to the very strong reception of Sandy Bridge, we have accelerated our 32-nanometer factory ramp...to enable us to meet the anticipated demand," he said at the time.

It's a big deal for PC parts and system makers, too. Recent reports citing Wall Street analysts making ominous-sounding statements about the sudden drop in PC demand is not only attributable to weakness in the U.S. and European economies but also likely due to a lull before Asian manufacturers shift to Sandy Bridge-based products later this year, said Doug Freedman, an analyst at Gleacher & Company.

(CNet)

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Only Chen
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發 表 於: 2010.08.20 11:08:46 AM
文章主題: Re: Intel助力!台北市府轉運站數位電子看板上身

Intel開發病毒剋星晶片?因應雲端運算與個人行動裝置商機??

================================

Virus-Busting Chips! Why Intel Paid Billions for McAfee.

Virus-Busting Chips! Why Intel Paid Billions for McAfee.

The news of Intel's very expensive McAfee purchase raises one obvious question: why is security software worth over $7 billion to a chip maker? Intel has been short on specifics, but it's becoming clear that virus-killing silicon is coming.

Computer security with hardware roots isn't new for Intel, but it's stuck in last-gen tech that can't stop your system from getting smoked. Feature sets that can help filter out malicious network traffic or let CPUs screen for certain worms have been safeguarding computers you've already thrown away by now. But they're limited. Right now, most of the anti-malware grunt work is being handled by software. Letting applications do the heavy lifting is a resource-heavy affair, which makes chipmakers like Intel nervous when they look forward and see the future of computing floating in the cloud.

The problem with security in the cloud is twofold. To begin with, netbooks and tablets usually just don't have the muscle to balance intensive malware efforts. Do you think your anemic netbook can root out marauding trojans, scanning hundreds of thousands of files, as well as your desktop? But what about just putting the security software in the cloud too? This leads to a second objection: do we really want our sensitive stuff floating out of our devices? Will people feel comfortable having their secrets scanned remotely? Intel doesn't think so—and says it has a solution.

When we interviewed Intel's head tech honcho, CTO Justin Rattner in June, he had much to say about the intersection of cloud computing and secure computing. And the future of beating viruses, according to Intel, lies in the chips that drive our devices, not some program running in the background. "As silicon developers," Rattner explained, "we have a requirement to provide truly secure capability when it's needed." This means malware-fighting hardware is a new mandate. Rattner asserts that their hardware ambitions are to "protect those systems from the various forms of malware and then, in addition, giving them the ability to keep their secrets no matter what happens." Which sounds a little abstract, right? But put it in context: Rattner's plan sounds pretty real as of right now.

While discussing the news of their acquisition today, Intel minced no words about where their pricey new subsidiary will take them. McAfee technology will be put on Intel silicon. Virus scanning, trojan hunting, buffer overflow-blocking—all beat back before it has a chance to touch your software. McAfee's line of applications will continue to sell as is, but Intel simply doesn't believe that the future of computer security can be done with software alone. Malware keeps getting meaner. To block viruses, you need to hit them as soon as possible, which means as deep into the hardware as possible. Think of it as the difference between swatting flies in your kitchen and just keeping your windows closed in the first place.

Intel's processors won't change for now, but when we asked them about the deal's implications for architecture changes down the line, they confirmed that the era of an antivirus-on-a-chip lies ahead—with a mysterious new hardware product slated for 2011. Thanks to Moore's Law, Intel will have more real estate to fill with security mechanisms—courtesy of McAfee's R&D labs. Whether secure silicon takes the form of hardware acceleration for virus-sniffing heuristics, or something else entirely, remains to be seen. But if Intel makes good on its promises (and on the nearly $8 billion it forked over), that folder of photos you regret will stay safe without having to climb to the cloud.

(gizmodo)

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Only Chen
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發 表 於: 2010.08.27 11:30:37 AM
文章主題: Re: Intel助力!台北市府轉運站數位電子看板上身

Intel, AMD vie to rewire PC's brain

Intel and AMD are off to the races again. This time it's about making PCs not just faster, but more versatile.

The two longstanding PC chip rivals seem to agree, roughly, on one thing: the need to meld the two key PC chips, the central and graphics processing units, into one processor. But they both bring different strengths to achieve that end.

Why combine chips? Put simply, it takes less energy to move electrons across a chip than to move those same electrons between two chips, so this saves energy, resulting in better battery life for laptops. A point made by Insight 64 principal analyst Nathan Brookwood in a white paper written for AMD, but which, in some fundamental respects, applies equally to Intel.

Heterogeneous computing combines functions typically found on a graphics processor with the main CPU chip.

Heterogeneous computing combines functions typically found on a graphics processor with the main CPU chip.

(Credit: AMD)

And CPUs and GPUs are suited to different kinds of computing. CPUs can handle a broad array of tasks, while GPUs are more specialized but much faster at certain types of operations. Future heterogeneous chips could find photos and videos in your library that contain particular faces or places. Or recognize your face when you log in. In short, putting both capabilities on one piece of silicon creates a brainier chip with more processing brawn.

The question, of course, is which company will deliver the goods and drive cutting-edge PC--particularly laptop--designs in 2011? AMD claims that because it is also a supplier of GPUs, via its ATI graphics chip unit, that its products are more forward-looking because of the increased emphasis on graphics via key multimedia technologies like Microsoft's DirectX and Apple's OpenCL.

"Intel is understandably more CPU centric. That's Intel's view," said John Taylor, director of marketing for Fusion at AMD. "We're a provider (via ATI) of graphics chips. We're incorporating world-class GPU intellectual property into a new type of design. We look at the GPU in a consumer notebook as a very efficient compute engine as well as all of the wonderful 2D and 3D graphics capabilities," Taylor said, adding that Intel is just "sprinkling" low-level graphics on its CPUs.

Not surprisingly, Intel, the world's largest chipmaker, believes it has the upper hand because its cutting-edge manufacturing technology allows it to integrate more on a piece of silicon, sooner. Intel's Atom chip, for example, already melds two processing cores and the graphics function on a single piece of silicon.

And Intel was the first--early this year--to move to 32-nanometer technology, which allows the chipmaker to cram more functions onto the chip. (Globalfoundries, AMD's manufacturing partner, won't make that move until 2011.) The upcoming 32-nanometer Sandy Bridge architecture from Intel will represent the fruition of this effort. "Sandy Bridge combines multiple cores together with the graphics circuitry on the same chip," said Mark Bohr, Intel senior fellow. "The fact that we're an aggregate device manufacturer allows us to do internal optimization of all of these pieces and bring out a leading-edge product sooner than other companies."

So, here's a brief overview of laptop-centric technologies that AMD and Intel are planning to roll out over the next 6 to 12 months or so. Consumers, of course, will ultimately decide who prevails.

AMD's Ontario (2010):

  • From-the-ground-up redesign; very-low-power x86 core
  • Single piece of silicon
  • Up to two CPU cores with a DirectX 11 ATI 5000 series GPU technology and new video decoder
  • Targeted at Netbook, ultrathin laptops, and all-in-one PCs
  • 40-nanometer "bulk" process; manufactured by TSMC*
  • Due to ship in Q4 2010 with laptops due early 2011
*Taiwan Semiconductor Manufacturing Company

 

AMD's Llano (2011):

  • Up to four CPU cores with DirectX 11 GPU, upgraded ATI 5000 series GPU technology and video decoder
  • Single piece of silicon
  • Targeted at mainstream and ultrathin laptops and certain desktop market segments
  • 32-nanometer High K metal gate process; manufactured by Globalfoundries
  • Due to ship in first half of 2011

 

Intel's Sandy Bridge:

  • Single piece of silicon, combining CPU and GPU
  • Faster on-chip communication: different parts talk via "improved inter-buses."
  • Improvements to the way instructions are executed
  • New instructions to accelerate multimedia: Intel Advanced Vector Extension (AVX) instructions.
  • Improved Turbo Boost: slowing down, speeding up individual cores as needed.
  • Special circuits for handling transcoding (conversion of video/audio from one format to another)
  • 32-nanometer High K metal gate process
  • Due to ship in Q4 (more details to be revealed at the Intel Developer Forum in September).

 

Intel's newest Atom for Netbooks:

  • Up to 2 cores, 4 threads
  • CPU integrates GPU on the same die (single piece of silicon)
  • Low-power: dual-core version has maximum thermal envelope of 8.5 watts
  • Shipment date: now

 

A few additional items worth noting:

High K metal: Intel has been building chips--since 2007-- with this transistor technology, which, generally yields chips that are faster and run cooler. AMD won't move to this technology until 2011.

32-nanometer: Intel has also been supplying 32-nanometer chips since early this year; AMD won't get there until 2011 but it is moving to an intermediate 40-nanometer process later this year.

AMD's "Bulldozer" core: This is a new 32-nanometer chip architecture due in the first half of 2011. Targeted initially at high-end desktop and servers, it will offer multi-threading, which increases the number of tasks a processing core can handle (Intel has been offering this for a long time). Bulldozer will yield high core counts (such as 8-core desktop chips) and support new x86 instructions, including SSE4.2 and AVX.

(Cnet)

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Only Chen
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發 表 於: 2010.08.27 11:42:11 AM
文章主題: Re: Intel助力!台北市府轉運站數位電子看板上身

Intel稱下一代筆記電腦晶片能播放藍光三維(3D)電影

英特爾星期四稱,英特爾即將推出的下一代筆記電腦晶片將有十幾項改善圖形性能的功能並且將能夠播放藍光三維電影。

英特爾發言人尼克Knupffer稱,配置基於桑迪橋架構的處理器的筆記電腦將能夠播放藍光三維電影,同時保持電池使用壽命。用戶不需要購買專門觀看三維內容的單獨的圖形處理器(晶片)。

英特爾發言人說,桑迪橋晶片計劃在今年晚些時候投產。英特爾曾表示,配置這種新型晶片的個人電腦將在明年上半年上市。

英特爾將在9月13日至15日在舊金山舉行的英特爾開發商論壇會議上詳細介紹桑迪橋晶片架構的圖形性能。

分析師稱,英特爾圖形晶片性能的改善來自於更高水平的集成和對解碼視頻增加了特殊的加速器。

Mercury Research的分析師迪安說,一代片與下一代晶片的圖形性能一般會成倍地增強。英特爾當前的筆記本電腦晶片能夠播放1080p的高清視訊。桑迪橋晶片將給個人電腦帶來明顯的圖形性能的改善

(WeiPhone)

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Tommy Chung
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發 表 於: 2010.11.17 11:32:31 AM
文章主題: Re: Intel助力!台北市府轉運站數位電子看板上身

Intel明年CES推下一代Sandy Bridge CPU     蘋果Apple可望受益

   

http://www.weiphone.com/apple/news/2010-11-17/CES_next_year_226617.shtml

(WeiPhone)

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Tommy Chung
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發 表 於: 2010.12.21 12:03:04 PM
文章主題: Re: Intel助力!台北市府轉運站數位電子看板上身

明年研發支出 台積電勝英特爾(Intel)

http://news.chinatimes.com/tech/0,5249,12050902x122010122100298,00.html

 

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Only Chen
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發 表 於: 2010.12.22 12:03:22 PM
文章主題: Re: Intel助力!台北市府轉運站數位電子看板上身
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