PICMG has announced the release of the COM-HPC 1.2 “Mini” specification. Measuring just 95 mm x 70 mm, COM-HPC Mini is nearly half the size of the next-smallest COM-HPC form factor and provides a cost-effective, lower power module for autonomous mobile robots, drones, mobile 5G test and measurement equipment, and other far edge application ...
u-blox and ORBCOMM have announced today their partnership to start developing solutions for the convergence of terrestrial and satellite IoT communications markets.
The cellular and satellite IoT communications markets have grown substantially and will continue to do so for years to come ...
TAIPEI, Taiwan - During the last 20 years, Airoha Technology, a Taiwanese fabless IC design house, MediaTek’s subsidiary has engaged in networking IC technologies development including the xDSL copper wire, GPON, xG-PON, and optical fiber ...
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Samsung Electronics introduced a standalone turnkey security solution comprised of a Secure Element (SE) chip (S3FV9RR) and enhanced security software that offers protection for tasks such as booting, isolated storage, mobile payment and other applications |
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Samsung Electronics introduced a standalone turnkey security solution comprised of a Secure Element (SE) chip (S3FV9RR) and enhanced security software that offers protection for tasks such as booting, isolated storage, mobile payment and other applications |
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