IBASE Technology launches a new ET975 COM Express Computer-on-Module based on the ultra-low voltage 7th Generation Intel Core i7/i5/i3 processor (Kaby Lake-U) produced using a 14 nanometer manufacturing process technology. Characterized with product longevity, performance computing and low power consumption, the ET975 is suitable for applications found in factory automation, kiosk, communications, medical imaging and digital signage environments.
The ET975 comes with features that provide high performance and reliable operation across a wide range of industrial and embedded applications. The ET975 COM Express Type 6 compact module is equipped with two DDR4-2133 SO-DIMM sockets with a 32GB memory capacity, operating temperature range from 0°C to +60°C, and Intel Gen 9 HD low-power integrated graphics on the SoC providing 4K resolution via popular display interfaces such as DVI, HDMI, DisplayPort and LVDS. A rich set of standard I/Os available are one gigabit Ethernet, four USB 3.0 and eight USB 2.0 ports, two serial ports and two SATA III ports.
The board supports the IBASE IP413 COM Express ATX carrier board with Type 6 pin-out and I/Os for 24-bit dual-channel LVDS, four USB 3.0, four USB 2.0, and HD audio with Realtek ALC662 codec. The module also comes with an integrated Trusted Platform Module (TPM 2.0) security feature, Digital I/O, watchdog timer, as well as two COM and two SATA III ports. Expansion is available with four PCI-E(1x) and one PCI-E(4x) supporting PCIe Gen 3 that allows faster connection on add-on cards and peripherals. Optional features include an embedded MultiMediaCard (eMMC) storage and a heat spreader. Dimensions of the extremely compact ET975 are 95mm x 95mm.
