HSINCHU, Taiwan - H.P. Lin, Chairman of M31 Technology today announced that it deploys a full range of silicon IP in TSMC's 16nm FFC (FinFET Compact) process technology.
The advanced 16nm FFC process not only enables more IC functions with less space, but also dramatically enhances the circuits by reducing leakage currents. M31 Technology completed the function verification and validation of 16nm FFC High Speed Standard Cell Library in the fourth quarter of 2016.
Based on the specific characteristics of 16nm, M31 focuses on the development of ultra-high-speed (12-track) standard cell library and low-power/low-voltage operating memory compilers. Utilizing the unique properties of the process, M31 engineering leverages its circuit design and IP development skills in efficiency and low power consumption to enable its customer’s end-user products to be more competitive.
In addition, M31 provides a set of ESD IO libraries that are customizable and address special needs for customers designing high-density and high-performance electrostatic protection products.
Suk Lee, TSMC Senior Director, Design Infrastructure Marketing Division, said: “The 16nm FFC process is an ideal technology to meet the requirements of power-saving and cost-effective products. It enables our mutual customers to achieve high performance and low power consumption SoC designs."
"M31 Technology has been working closely with TSMC for five years,” said H.P. Lin, Chairman of M31 Technology.
"With our unique approach of low-power IP design, M31 has successfully accomplished numerous silicon validated IP in various TSMC platforms, from 180nm to 16nm process. In the latter half of 2017, M31 will provide a full range of verified IP in TSMC 16nm FFC process. Our objective is to be the leader in providing unique silicon IP solutions for the global IC design industry."
