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RECIF Technologies Presents R.PACK Software Suite (2025.06.20)
RECIF Technologies announced the launch of R.PACK, the next-generation software suite designed for RECIF sorters. With an emphasis on usability, efficiency, and innovation, R.PACK introduces a suite of advanced features aimed at simplifying the management of wafer sorting equipment |
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RECIF Technologies Presents R.PACK Software Suite (2025.06.20)
RECIF Technologies announced the launch of R.PACK, the next-generation software suite designed for RECIF sorters. With an emphasis on usability, efficiency, and innovation, R.PACK introduces a suite of advanced features aimed at simplifying the management of wafer sorting equipment |
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u-blox Introduces ANNA-B5: Compact, Powerful and Secure Bluetooth LE module (2025.05.22)
u-blox announces the launch of the ANNA-B5 BluetoothR LE module. Built on Nordic Semiconductor’s next-generation wireless SoC, the nRF54L15 chipset with industry-leading processing power and efficiency, this ultra-compact module (6 |
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u-blox Introduces ANNA-B5: Compact, Powerful and Secure Bluetooth LE module (2025.05.22)
u-blox announces the launch of the ANNA-B5 Bluetooth® LE module. Built on Nordic Semiconductor’s next-generation wireless SoC, the nRF54L15 chipset with industry-leading processing power and efficiency, this ultra-compact module (6 |
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Trymax Semiconductor Equipment B.V. Reaches 500 Process Chamber Installations in Asia (2025.05.22)
Trymax Semiconductor Equipment (Trymax) announces the installation of its 500th process chamber in Asia. This milestone reflects continued momentum across key regional markets—including China, Taiwan, South Korea, Malaysia, and the Philippines—and signals strong progress toward the company’s goal of 1,000 global installations by the end of 2025 |
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Trymax Semiconductor Equipment B.V. Reaches 500 Process Chamber Installations in Asia (2025.05.22)
Trymax Semiconductor Equipment (Trymax) announces the installation of its 500th process chamber in Asia. This milestone reflects continued momentum across key regional markets—including China, Taiwan, South Korea, Malaysia, and the Philippines—and signals strong progress toward the company’s goal of 1,000 global installations by the end of 2025 |
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Accuron Technologies Acquires Majority Stake in Trymax Semiconductor (2025.02.19)
Accuron Technologies secures a controlling interest in Trymax Semiconductor Equipment (Trymax), a specialist in plasma-based and UV-based process equipment and solutions for semiconductor manufacturers. This transaction expands Accuron’s scope of solutions in the Semiconductor Equipment sector and strengthens its European presence |
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Accuron Technologies Acquires Majority Stake in Trymax Semiconductor (2025.02.19)
Accuron Technologies secures a controlling interest in Trymax Semiconductor Equipment (Trymax), a specialist in plasma-based and UV-based process equipment and solutions for semiconductor manufacturers. This transaction expands Accuron’s scope of solutions in the Semiconductor Equipment sector and strengthens its European presence |
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u-blox Launches New GNSS Chip for Wearable Featuring Ultra-low Power and High Accuracy (2024.12.30)
u-blox has introduced a new, ultra-low power GNSS chip that represents a major breakthrough in compact and efficient positioning technology. The UBX-M10150-CC GNSS is poised to revolutionize the design of compact wearable devices like sports and smart watches by offering an unprecedented combination of size, efficiency, and performance |
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u-blox Launches New GNSS Chip for Wearable Featuring Ultra-low Power and High Accuracy (2024.12.30)
u-blox has introduced a new, ultra-low power GNSS chip that represents a major breakthrough in compact and efficient positioning technology. The UBX-M10150-CC GNSS is poised to revolutionize the design of compact wearable devices like sports and smart watches by offering an unprecedented combination of size, efficiency, and performance |
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HOLTEK New HT32F61730/741 Li-Battery Management MCUs (2024.12.10)
Holtek announced the release of two new Li-Battery management MCUs, the HT32F61730 and HT32F61741. Compared with the second generation HT32F61630 and HT32F61641 devices, these new MCUs also have internal Li-battery voltage detection circuitry but now with an increased accuracy of ±15mV |
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HOLTEK New HT32F61730/741 Li-Battery Management MCUs (2024.12.10)
Holtek announced the release of two new Li-Battery management MCUs, the HT32F61730 and HT32F61741. Compared with the second generation HT32F61630 and HT32F61641 devices, these new MCUs also have internal Li-battery voltage detection circuitry but now with an increased accuracy of ±15mV |
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esmo group Introduces World’s First Automated Final Test Manipulator (2024.12.10)
esmo group (esmo) announced the launch of ares auto setup, the world’s first final test manipulator capable of automated test head finding and positioning.
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Final test manipulators play a pivotal role in semiconductor manufacturing |
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esmo group Introduces World’s First Automated Final Test Manipulator (2024.12.10)
esmo group (esmo) announced the launch of ares auto setup, the world’s first final test manipulator capable of automated test head finding and positioning.
Final test manipulators play a pivotal role in semiconductor manufacturing |
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SnapMagic and Harwin Partner to Help Engineers Design Faster (2024.11.14)
SnapMagic and Harwin have partnered to release over 3500 new computer-aided design (CAD) models that will help engineers design electronics faster.
Engineers can spend weeks creating CAD models for their printed circuit board (PCB) designs in what is often a laborious and complex process |
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SnapMagic and Harwin Partner to Help Engineers Design Faster (2024.11.14)
SnapMagic and Harwin have partnered to release over 3500 new computer-aided design (CAD) models that will help engineers design electronics faster.
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Engineers can spend weeks creating CAD models for their printed circuit board (PCB) designs in what is often a laborious and complex process |
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NexGen Wafer Systems Introduces SERENO: A Versatile, High-Throughput Wet Etch and Clean Solution (2024.11.11)
NexGen Wafer Systems announced the launch of SERENO, its latest multi-chamber platform designed for Wet Etch and Clean applications.
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SERENO combines high performance with exceptional flexibility, offering integrated metrology for precise substrate and layer thickness control, as well as surface roughness control |
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NexGen Wafer Systems Introduces SERENO: A Versatile, High-Throughput Wet Etch and Clean Solution (2024.11.11)
NexGen Wafer Systems announced the launch of SERENO, its latest multi-chamber platform designed for Wet Etch and Clean applications.
SERENO combines high performance with exceptional flexibility, offering integrated metrology for precise substrate and layer thickness control, as well as surface roughness control |
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esmo group Launches Apollo Quad Handler to Revolutionize Semiconductor Testing (2024.11.06)
esmo group (esmo) announced the launch of its latest product—the Apollo Quad Handler. Designed to bridge the gap between the engineering and production phases, this advanced handler offers unprecedented flexibility, reliability, and energy efficiency for final test operations, setting a new standard for semiconductor testing |
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esmo group Launches Apollo Quad Handler to Revolutionize Semiconductor Testing (2024.11.06)
esmo group (esmo) announced the launch of its latest product—the Apollo Quad Handler. Designed to bridge the gap between the engineering and production phases, this advanced handler offers unprecedented flexibility, reliability, and energy efficiency for final test operations, setting a new standard for semiconductor testing |
