At 2026 CES, Etron will showcase the RPC inside G120 subsystem, which recently won the Taiwan Hsinchu Science Park 2025 Innovative Product Award. This solution incorporates Etron’s innovative RPC DRAM, which delivers x16 DDR3 data bandwidth in a compact Known-Good-Die or FI-WLCSP package. Compared to standard DDR3, this approach simplifies wire bonding and packaging design, helping to reduce overall system costs. By integrating the RPC DRAM and Controller with 3D depth-sensing chips from our subsidiary, eYs3D, the subsystem offers an effective AI edge platform for miniaturized, low-power, and specific ASIC applications.

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Etron’s complete memory solutions can fully satisfy customer needs ranging from Wi-Fi 5, Wi-Fi 6/6E, Wi-Fi 7, and beyond. Additionally, Etron’s deep strategic alliances with supply chain partners enable us to provide customers with a long-term and reliable supply of DDR4 & LPDDR4/4X products.

As the semiconductor market evolves, Etron Technology remains focused on customer requirements. Through our commitment to innovation and robust Longevity Support programs, we consistently refine our technology and services, positioning ourselves as your trusted memory partner dedicated to meeting long-term industry demands.