「團戰」抗美韓 台灣記憶體產業靠客製化與邊緣AI殺出重圍 (2026.08.04)

面對美韓大廠在主流HBM與DDR5市場的強勢進擊，台灣記憶體產業改打「供應鏈團體戰」，透過全面轉向邊緣AI與車用等利基市場，發揮高整合度與深度客製化的晶片設計優勢，在AI時代開創出無可取代的成功之道。…

解析USB4測試挑戰 (2025.04.08)

從8K影音串流到工業物聯網，從電動車智能座艙到邊緣運算節點，這場由USB4介面所驅動的技術革命，正在重塑人類與數位世界的互動方式。…

5G訊號影響飛安？電磁訊號模擬有解方！ (2022.02.21)

美國聯邦航空局近期宣布了一項裁決，飛行員在新的5G訊號可能干擾雷達高度計系統的情況下，因此禁止使用自動降落系統。…

Lextar UVC tech Helps to upgrade epidemic prevention (2022.02.11)

Since the outbreak of COVID-19, the demand for sterilization has surged, and the application of UVC LED has become more …

NaviBlind Leverages u-blox's GNSS to Empower the Blind and Visually Impaired (2021.11.09)

u-blox today announced that NaviBlind, a technology provider delivering independent, safe, and flexible navigation to bl…

筑波科技6G太赫茲全頻段介電常數量測系統 (2021.02.19)

現今不論是在多媒體影音串流、車載物聯網、雲端運算、資料儲存及航太設備軍事雷達應用，對無線通訊的「寬頻」技術的需求逐漸增加。隨著頻率在毫米波(mmWave)的5G系統、超過60 GHz的車用、軍用、工業用雷達日益普及，5G、6G技術驅動電子材…

STMicroelectronics Releases KNX-RF Software for Power-Conscious Building Automation (2020.10.22)

STMicroelectronics has released KNX software for the S2-LP ultra-low-power radio transceiver to enable energy-saving sta…

COM Express Module Supports PCIe Gen4 and AI Optimization (2020.09.23)

ADLINK Technology launches its next generation COM Express Type 6 module, the cExpress-TL, based on the 11th Gen Intel C…

HOLTEK New HT66F4560 MCU with 4-level Adjustable Bandwidth OPA (2020.09.14)

Holtek announced the release of its new A/D with OPA Flash MCU, the HT66F4560. One of the chief features of this device …

Imec Presents Low-power 60 GHz Radar Chip for Contactless Health Tracking in Battery-powered Devices (2020.08.05)

This week at the virtual conference IEEE RFIC, leading research and innovation hub imec presents a millimeter-wave motio…

5G服務加緊腳步 毫米波頻段競賽越演越烈 (2020.05.21)

隨著5G登場，全世界都將關注並觀察未來毫米波技術的應用方式。…

TDDI Manufacturing Moves to More Advanced Process Technologies, Says TrendForce (2019.12.13)

According to the latest analysis from the WitsView research division of TrendForce, as electronic device manufacturers s…

異質整合推動封裝前進新境界 (2019.10.02)

在多功能、高效能、低成本、低功耗，及小面積等要求發展的情況下，需將把多種不同功能的晶片整合於單一模組中。…

Samsung and SK Telecom Showcase Real-World 5G Use Case in High-Speed Motor Racing (2019.08.28)

Samsung Electronics and SK Telecom today announced a successful demonstration of how 5G technology can improve motor rac…

Gartner: 5G Network Infrastructure Revenue to Reach $4.2 Billion in 2020 (2019.08.26)

In 2020, worldwide 5G wireless network infrastructure revenue will reach $4.2 billion, an 89% increase from 2019 revenue…

TRUST-U's SerDes Communications Chip Technology Enters International Market (2019.06.19)

TAIPEI, Taiwan - Supervised by Dr. Jerry Lee, the startup team specializes on the research of "Development of Ultra High…

Faraday Geared Up for Data Communication Applications in ASIC Development (2019.05.21)

HSINCHU, Taiwan - Faraday Technology today announced its achievement in delivering more than 10 successful projects in t…

Samsung Introduces Exynos i T100 for Secure and Reliable IoT Devices (2019.05.07)

Samsung Electronics announced a new Internet of Things (IoT) solution, the Exynos i T100, which enhances the security an…

M31 Develops SRAM Compiler IP on TSMC’s 28nm Embedded Flash Process Technology (2019.04.17)

HSINCHU, Taiwan - M31 Technology today announces that it will develop SRAM Compiler IP on TSMC's 28nm Embedded Flash pro…

LitePoint and Movandi Collaborate to Increase Performance of 5G Millimeter Wave Solutions (2019.02.20)

LitePoint announced today that Movandi has selected LitePoint’s IQgig-5G millimeter wave (mmWave) test system for design…