NXP推出整合神經處理引擎i.MX處理器 支援MI邊緣運算 (2020.01.13)

恩智浦半導體（NXP Semiconductors N.V.）宣佈推出i.MX 8M Plus應用處理器，進一步擴展EdgeVerse產品組合。此為恩智浦首個整合專用神經處理引擎（Neural Processing Unit；NPU）的i.…

ANSYS完成最新台積電5奈米FinFET製程技術認證 (2019.04.23)

台積電和ANSYS支援新世代應用電源完整性和可靠度多物理場解決方案 台積電（TSMC）和ANSYS（NASDAQ: ANSS）透過全新認證和完整半導體設計解決方案，幫助共同客戶滿足新世代行動、網路、5G、人工智慧 （AI）、雲端和資料中心應…

Mentor擴展可支援台積電5奈米FinFET與7奈米FinFET Plus 製程技術的解決方案 (2018.11.20)

Mentor今（20）天宣佈其Mentor CalibreR nmPlatform 與Analog FastSPICE (AFS) 平台已通過台積電7奈米 FinFET Plus 與最新版本的5奈米FinFET製程認證。此外，Mentor …

Mentor擴展可支援台積電5/7奈米FinFET Plus 製程技術的解決方案 (2018.11.19)

Mentor今天宣佈，該公司的Mentor Calibre nmPlatform 與Analog FastSPICE (AFS) 平台已通過台積電7奈米 FinFET Plus 與最新版本的5奈米FinFET製程認證。此外，Mentor 持…

ANSYS獲三星晶圓代工自加熱、電源完整性和電子遷移解決方案認證 (2018.06.27)

ANSYS解決方案已獲三星晶圓代工部門（Samsung Foundry）電源完整性和可靠度分析認證與支援，這將有助雙方共同客戶製作可靠穩健的新一代電子元件。該認證支援三星晶圓代工部門最新7奈米（7LPP；7-nanometer Low Po…

Mentor強化支援台積電5nm、7nm製程及晶圓堆疊技術的工具組合 (2018.05.02)

Mentor宣佈該公司Calibre nmPlatform 和Analog FastSPICE (AFS) 平台中的多項工具已通過台積電(TSMC)最新版5奈米FinFET和7奈米 FinFET Plus製程的認證，Mentor 亦宣佈，已…

Samsung Starts Mass Production of Its 2nd Generation 10nm FinFET Process Technology (2017.11.29)

Samsung Electronics today announced that its Foundry Business has commenced mass production of System-on-Chip (SoC) prod…

ANSYS獲頒三項台積電年度夥伴獎 (2017.11.08)

台積電 （TSMC）與ANSYS提供電源和可靠度分析解決方案，協助客戶成功開發新一代行動、高效能運算和車用應用。台積電於今年的開放創新平台（Open Innovation Platform; OIP）生態系統論壇上頒發三項獎項給ANSYS，…

Samsung Completes Qualification of 8nm LPP Process (2017.10.18)

Samsung Electronics announced today that 8-nanometer (nm) FinFET process technology, 8LPP (Low Power Plus), has been qua…

Samsung Adds 11nm FinFET Process Technology to Its Advanced Foundry Process Portfolio (2017.09.11)

Samsung Electronics today announced it has added 11-nanometer (nm) FinFET process technology (11LPP, Low Power Plus) to …

Samsung Completes Qualification of Its 2nd Generation 10nm Process Technology (2017.04.19)

Samsung Electronics announced today that its second generation 10-nanometer (nm) FinFET process technology, 10LPP (Low P…

eMemory Qualified NeoFuse in TSMC 16FFC Process (2017.02.08)

HSINCHU, Taiwan – Taiwanese NVM IP provider eMemory announces the availability of NeoFuse technology, qualified in TSMC’…

小米5s/5s Plus連袂出擊 號稱特色為搭載高通最強處理器 (2016.10.05)

小米於日前正式揭開最新款手機5s/5s Plus的神秘面紗。該兩款手機皆採用行動晶片大廠高通至今最強處理器Snapdragon821，為這兩款手機帶來了強大的性能保證，從首創「無孔式」指紋辨識到擁有「人眼特性」的雙鏡頭各具特色。 此次小米5…

TSMC Gets the Upper Hand over Samsung on 16/14nm Process (2015.11.10)

TAIPEI, Taiwan － According to MIC (Market Intelligence and Consulting Institute), TSMC is anticipated to gain back its f…

Synopsys Demonstrates MIPI D-PHY IP Operating at 2.5 Gbps per Lane on TSMC 16FF+ (2015.10.22)

Synopsys announced the demonstration of MIPI D-PHY IP on TSMC's 16-nanometer (nm) FinFET Plus (16FF+) process operating …

Synopsys Successfully Tapes Out Broad IP Portfolio for TSMC 10-nm FinFET Process (2015.09.18)

Synopsys today announced the successful tape-out of a broad portfolio of DesignWare Interface and Foundation IP on TSMC'…

eMemory Announces the First Verified NeoFuse OTP IP in 16nm FinFET Plus Process (2015.09.15)

HSINCHU, Taiwan – eMemory announces its new technology breakthrough–the availability of its One-Time Programmable (OTP) …

Synopsys Certified from Multiple Standards IP on TSMC's 16FF+ Process (2015.07.30)

Synopsys, Inc., today announced that it has achieved certification and compliance from multiple standard organizations f…

A9 Processor Being Developed by Samsung and TSMC (2015.07.24)

TAIPEI, Taiwan — It has been reported that Samsung Electronics and Taiwan Semiconductor Manufacturing Co. (TSMC) have no…

Cadence數位與客製/類比工具通過台積電10nm FinFET製程認證 (2015.04.13)

益華電腦（Cadence）的數位與客製/類比工具軟體已通過TSMC台積公司最新10奈米FinFET製程技術的設計參考手冊（Design Rule Manual, DRM）與SPICE模型認證。 Cadence客製/類比和數位設計實現與sig…