2026 R&S衛星通訊論壇: 集技術、演化與互通性睿見的無線通訊饗宴 (2026.04.02)

受地緣政治與區域戰爭影響，現今國際情勢多變，衛星通訊及無人機技術實為國家安全韌性的重要戰略議題。德國量測儀器大廠台灣羅德史瓦茲（Rohde & Schwarz Taiwan）偕同 APSCC（亞太衛星通訊委員會）共同主辦、財團法人資訊工業策…

SnapEDA Launches Syndication Network Spanning over 30 Distribution Partners (2022.09.29)

SnapEDA, the first search engine for electronics design is launching the SnapEDA Syndication Network. This ecosystem of …

MIC:Global Notebook PC Shipment Volume Estimated to Reach 220 Million Units (2022.06.17)

Taiwan`s government-backed research institute MIC (Market Intelligence & Consulting Institute) announces at 2022 MIC Spr…

AUO Joins RE100 Initiative and Commits to 100% Renewable Energy by 2050 (2022.03.24)

AU Optronics Corp Announces that it has become a formal member of RE100 global renewable energy initiative and the first…

台達與臺大共同成立研發中心 打造虛實整合實驗場域 (2022.03.18)

台達電子與臺灣大學今日共同宣布成立「台達臺大聯合研發中心」，由台達董事長海英俊與臺大校長管中閔共同主持揭牌儀式，開啟雙方合作的新里程碑。 台達預計投入逾億元研發經費，打造虛實整合的前瞻實驗場域，以自主化 （Autonomous）及永續發展（…

雲端化加快數位轉型 SolidWorks提供彈性完整解決方案 (2021.06.22)

面對近年來本土疫情升溫達到三級警戒，居家遠距作業（WFH）也從一般服務業擴及製造業的行政及設計開發領域，亦須落實分艙分流規定，亟須透過專業軟體、雲平台服務協助，始能收事半功倍之效。達梭系統SOLIDWORKS執行長Gian Paolo Ba…

Samsung Introduces PixCell LED for Intelligent Headlight Systems (2021.04.18)

Samsung Electronics announced PixCell LED, a new automotive LED module optimized for intelligent headlights, such as ada…

達梭3DEXPERIENCE World 2021推雲端新品 強調創客與教育協作 (2021.02.25)

在全球疫情蔓延未止的威脅下，達梭系統（Dassault Systemes）今年在線上舉行的「3DEXPERIENCE World 2021」全球大會，除了發表旗下最新雲端產品，透過連結強大的3D數位設計、工程與協作應用，幫助用戶積累專業知識…

MediaTek Launches 6nm Dimensity 1200 Flagship 5G SoC (2021.01.20)

HSINCHU, Taiwan – MediaTek today unveiled its new Dimensity 1200 and Dimensity 1100 5G smartphone chipsets with unrivale…

DRAM Leads in Revenue, NAND With Top Percentage Growth in 2020 (2020.12.07)

Coming as no surprise, each of the top-five IC product categories in terms of sales all have ties to computing or commun…

AUO Debuts High-end Surgical Display Solutions to Help Shape Future Smart Medical Care (2020.12.03)

HSINCHU, Taiwan – AUO announced that it will showcase its premium 3D surgical display solutions at the Healthcare Expo T…

Intel to Keep Its Number One Semiconductor Supplier Ranking in 2020 (2020.11.24)

IC Insights announced its November Update to the 2020 McClean Report. The forecasted 2020 top-15 semiconductor supplier …

LTPS Smartphone Panels in 2021 Likely to Be Constrained (2020.11.09)

As the COVID-19 pandemic caused flagship smartphones to turn in lower-than-expected sales performances in 1H20, the mark…

DRAM Price Erosion Expected Through the End of 2020, Says IC Insights (2020.10.28)

IC Insights’ October Update to The McClean Report showed the monthly average selling price (ASP) of DRAM started on a st…

Kingston, ADATA, Tigo Take Top Three of SSD Module Makers (2020.10.27)

The total worldwide shipments of branded SSDs bound for the channel (retail) market in 2019 reached 131 million units, s…

TrendForce Announces 10 Tech Industry Trends for 2021 (2020.10.06)

TAIPEI, Taiwan - TrendForce presents its forecast of 10 key trends in the tech industry for 2021, across various sectors…

Samsung Begins Mass Production of 16Gb LPDDR5 DRAM at World (2020.08.31)

Samsung Electronics today announced that its second production line in Pyeongtaek, Korea, has commenced mass production …

STMicroelectronics and Fingerprint Cards to Launch an Advanced Biometric Payment Card Solution (2020.07.27)

STMicroelectronics has teamed with Fingerprint Cards AB (Fingerprints) to develop an advanced Biometric System-on-Card (…

HOLTEK New HT66F3185 A/D MCU with EEPROM (2020.06.03)

Holtek announces the release of a new addition to its A/D type Flash MCU range with the new HT66F3185. As an extension p…

Panel Quotes and Manufacturer Revenues May Stabilize in 2Q20, Says TrendForce (2020.06.02)

According to the latest investigations by the WitsView research division of TrendForce, as panel demand begins to reboun…