AI晶片走向系統戰 台積電整合CoWoS與矽光子 (2026.09.01)
生成式AI帶動算力需求持續攀升，半導體競爭焦點已由單一先進製程，轉向運算、記憶體、封裝與高速互連的系統級整合。台積電在SEMICON Taiwan 2026展前論壇指出，未來AI基礎設施新增容量可能由過去每年約5至6GW，提高至30至40G…
搜尋「compact」，共 1563 筆
全新conga-TCRP1可擴展邊緣運算效能符合嚴苛應用需求 (2026.03.19)
在邊緣AI與嵌入式高效能運算需求快速升溫的趨勢下，康佳特（congatec）推出全新COM Express 3.1 Type 6 Compact模組——conga-TCRP1，進一步強化運算效能、AI推論能力與系統擴展彈性，鎖定智慧醫療、工…
康佳特以異構核心電腦模組重塑嵌入式 AI 設計 (2026.01.06)
嵌入式與邊緣運算建構模組供應商德國康佳特 (congatec)發表基於 Intel Core Ultra Series 3處理器的電腦模組。這款全新高效能模組可提供高達 180 TOPS 的卓越能效運算，專為新一代 AI 加速需求所設計。在…
At 2026 CES, Etron will showcase the RPC inside G120 subsystem, which recently won the Taiwan Hsinchu Science Park 2025 …
鎖定極端環境應用 康佳特conga-TC675r模組通過IEC 60068測試 (2025.10.23)
全球嵌入式與邊緣運算技術商德國康佳特 (congatec) 宣布，其 conga-TC675r COM Express Compact Type 6 模組已成功通過 IEC 60068 環境耐受性測試。此為全球針對極端環境條件最嚴苛的標準之…
宜鼎推出LPCAMM2與CAMM2系列記憶體模組 (2025.08.08)
全球嵌入式儲存與工控記憶體領導品牌宜鼎國際（Innodisk）正式推出 LPDDR5X CAMM2（亦稱LPCAMM2）與 DDR5 CAMM2 模組。此系列產品採用創新的雙通道記憶體架構，兼具纖薄外型、高頻寬、可升級與抗震等特性，適用於嚴…
AI時代來了！Cadence帶你探索PCB設計與多物理場模擬的未來 (2025.08.04)
為了應對AI時代電子產品的複雜設計挑戰，CTIMES與Cadence於近日攜手舉辦了一場專為「AI世代PCB設計與多物理場模擬量身打造的」東西講座－科技沙龍。深入剖析現代的工程師如何運用AI技術來優化PCB佈局、提升效率；同時也說明如何透過…
RECIF Technologies Presents R.PACK Software Suite (2025.06.20)
RECIF Technologies announced the launch of R.PACK, the next-generation software suite designed for RECIF sorters. With a…
u-blox announces the launch of the ANNA-B5 BluetoothR LE module. Built on Nordic Semiconductor’s next-generation wireles…
u-blox has introduced a new, ultra-low power GNSS chip that represents a major breakthrough in compact and efficient pos…
創新光科技提升汽車外飾燈照明度 (2024.12.02)
現階段的汽車照明設計正朝著動態高解析度和高像素數的方向發展，逐步向創新驅動轉變，而不斷優化和提升車用LED的效能與成本效益，已成為新產品開發過程中的核心追求。…
NexGen Wafer Systems Introduces SERENO: A Versatile, High-Throughput Wet Etch and Clean Solution (2024.11.11)
NexGen Wafer Systems announced the launch of SERENO, its latest multi-chamber platform designed for Wet Etch and Clean a…
Kandou Announces Zetti, the World’s First Small Scale PCIe 5.0 Ready Transport Layer Switch (2024.10.23)
Kandou, a global specialist in high-speed, energy-efficient connectivity solutions, has announced Zetti, a PCIe 5.0 tran…
Swiss high-speed interface technology provider Kandou recently unveiled the world's first small form factor PCIe Transpo…
Aerotech Expands XA4 PWM Servo Drive Series (2024.10.08)
Aerotech In has expanded its Automation1 XA4 PWM servo drive series. Designed to provide customers with a high-performan…
數位勞動力開啟儲運新時代 (2024.09.30)
當台灣已進入老齡少子化社會以來，缺工已成常態，業者也該積極重塑產業環境，讓新進人員生活得更有成就感，而非單純從事辛苦重覆的理/搬貨工作。…
文AI-Driven Industrial Transformation and Trends (2024.09.01)
Despite a slow global economic recovery in 2024, the AI wave is set to propel growth in global information systems products. With the enhanced integration of AI PC software and hardware in 2025, this sector will become a key driver of industrial revival. AI servers, fueled by the demand for generative AI large language models and internal corporate model fine-tuning, will be the primary growth engine for the server market in 2024.…
u-blox Empowers Global Connectivity with New Ultra-compact LTE Cat 1bis Cellular Modules (2024.07.01)
u-blox announces an expansion to its popular range of R10 products for the fast-growing LTE Cat 1bis cellular connectivi…
艾邁斯歐司朗與極氪共創智慧汽車駕乘新體驗 (2024.06.17)
在競爭日益激烈的電動汽車市場，各家車廠不斷加碼智慧化和個性化配置，以滿足使用者不斷提升的需求。艾邁斯歐司朗（AMS）今（17）日宣佈協助極氪汽車打造智慧駕乘體驗，並在日前舉辦的北京國際車展展出多款車型，其中基於浩瀚—M架構打造的首款家用車型…
u-blox has announced two additions to its Bluetooth LE portfolio, ALMA-B1 and NORA-B2. The modules are based on the late…