2奈米旗艦晶片成本激增20% 或將改變未來終端裝置市場定位 (2026.05.12)
根據供應鏈最新消息指出，全球兩大行動晶片龍頭高通與聯發科傳出將提前導入 2 奈米製程。…
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RISC-V實現「為應用而生」的晶片設計 (2026.04.10)
RISC-V的崛起，不僅僅是技術的更迭，更是一場關於「運算主權」的革命。它讓中小型晶片設計公司擁有了與巨頭競爭的機會，也讓特定領域計算（DSA）能以更低的成本實現。…
Kandou Announces Zetti, the World’s First Small Scale PCIe 5.0 Ready Transport Layer Switch (2024.10.23)
Kandou, a global specialist in high-speed, energy-efficient connectivity solutions, has announced Zetti, a PCIe 5.0 tran…
解讀新一代汽車高速連接標準A-PHY (2024.07.04)
隨著汽車行業的快速發展，車載通信技術也在不斷進步。MIPI A-PHY作為一項新興的連接標準，專為汽車應用設計的高速串列器-解串器（SerDes）實體層介面，正逐漸成為車載通信領域的明星技術。…
2023 IEEE亞洲固態電路研討會 台灣獲選論文搶先發表 (2023.10.27)
在全球的半導體產業中，亞洲居於主導位置，而IEEE亞洲固態電路研討會（Asian Solid-State Circuits Conference；A-SSCC）為亞洲IC設計領域學術發表的最高指標。IEEE固態電路學會台北分會（SSCS）今…
PICMG has announced the release of the COM-HPC 1.2 “Mini” specification. Measuring just 95 mm x 70 mm, COM-HPC Mini is n…
從Embedded World 2023看Edge AI及TinyML最新發展趨勢 (2023.04.21)
2023年嵌入式世界展會（EW23）推出不少MPU和MCU及對應的開發板，亦開始向Edge AI及TinyML移動，本文提出幾個值得關注的發展趨勢及亮點產品。…
Samsung and AMD Extend IP Licensing Agreement to Bring AMD Radeon Graphics to Mobile Platforms (2023.04.09)
Samsung Electronics announced they have signed a multi-year agreement extension to bring multiple generations of high-pe…
TAIPEI, Taiwan – STMicroelectronics and trinamiX, a wholly owned subsidiary of BASF SE and pioneer of new biometric tech…
Thalwil, Switzerland – u-blox Announces the u-blox ANT-B10 antenna board for Bluetooth direction finding and indoor posi…
IC Insights:Microprocessor Growth Will Slow in 2022 (2022.02.28)
Total MPU sales are expected to rise 7% this year with cellphone processors increasing 10% following a 31% jump in 2021;…
CTIMES資深編輯看2022年 (2021.12.29)
COVID-19疫情波及，也出現許多跨域、跨產業線上活動。而活動內容仍然包括新產品或技術的發表、組織與策略的推出、國際型展覽、研討會，以及第一線廠商與專家的專訪。 面臨即將到來的2022年，CTIMES的編輯們針對自身所關注的領域，提出各自對於科技產業的觀察心得與看法，以下就是CTIMES的編輯們的2022年產業觀察。…
[新聞十日談]NVIDIA GTC 2021是科幻，還是未來世界? (2021.12.29)
NVIDIA的年度技術大會GTC（GPU Technology Conference），已經成為科技產業的重要發展指標。會中所發表的一系列新技術與新應用...…
MicroSys Partners with AI Chipmaker Hailo to Launch High-Performance, Embedded AI Platform (2021.10.08)
MicroSys Electronics announced its partnership with leading AI (Artificial Intelligence) chipmaker Hailo to launch its m…
MicroSys Electronics announces the world’s first System-on-Module (SoM) with NXP Semiconductors S32G274A processor. The …
MediaTek Launches 6nm Dimensity 1200 Flagship 5G SoC (2021.01.20)
HSINCHU, Taiwan – MediaTek today unveiled its new Dimensity 1200 and Dimensity 1100 5G smartphone chipsets with unrivale…
TAIPEI, Taiwan - Intel has outsourced the production of about 15-20% of its non-CPU chips, with most of the wafer starts…
TAIPEI, Taiwan - Acer unveiled its first Chromebook with new AMD Ryzen 3000 C-Series Mobile Processors and AMD Radeon gr…
TAIPEI, Taiwan - Owing to the impact of the COVID-19 pandemic, global smartphone production reached a mere 1.25 billion …
After nearly two months of negotiations and press reports that a blockbuster deal was in the works, Nvidia this week ann…