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Avalue’s Latest PICMG COM R3.0 Type 6 module, ESM-CFH

瀏覽次數:1694

Avalue’s high-quality SOM (System on Module) takes the modular concept to a whole new level, effectively shortening the R&D timeline, facilitating the development of compatible products that adapt to the harsh environment, helping customers create infinite possibilities. Avalue’s Latest PICMG COM R3.0 Type 6 module, ESM-CFH, is adopting Intel 9th/ 8th Generation Xeon &Core i7 / i5 / i3 Processors. ESM-CFH is an ideal solution for embedded edge computing, classic high-end medical imaging systems, and HMIs as well as high-end gaming, infotainment and digital signage systems that require best-in-class computing power.

ESM-CFH, a PICMG COM R3.0 Type 6 module with Intel 9th/ 8th Generation Xeon &Core i7 / i5 / i3 Processors. It offers up to 3x 260-pin DDR4 2400 SO-DIMM with up to 96 Gbyte (non-ECC/ECC), 3rd socket on the rear side. Flexible I/O supports with 4 USB 3.2 Gen.2(10GB/s ), 8 USB 2.0, 1 Gen3 PEGx16, 8 PCIex1, 4 SATAIII. ESM-CFH also supports dual-channel 18/24-bit LVDS, VGA, DP/HDMI/DVI, (eDP Option). With +9 ~ +19V wide range power input supported, ESM-CFH is suitable for various vertical industry applications and harsh environment uses.

Compare with the previous generation product, ESM-KBLH, ESM-CFH comes with better CPU performance in the same thermal envelope. And support workstation CPU/ Mobile Core i H series CPU. TDP options of 45W (with 35W cTDP down), 35W, and 25W give an excellent balance of performance and power. ESM-CFH supports 3 independent 4K HD displays.

超大規模資料中心重塑AI基礎設施
特別企劃半導體AI

超大規模資料中心重塑AI基礎設施

為了增加資料傳輸的速度、距離和效率,AI生態系統正在探索射頻(RF)矽中介層技術,以實現互補式金氧半導體(CMOS)、雙極互補式金氧半導體(BiCMOS)與三五族材料的異質整合。

為了增加資料傳輸的速度、距離和效率,AI生態系統正在探索射頻(RF)矽中介層技術,以實現互補式金氧半導體(CMOS)、雙極互補式金氧半導體(BiCMOS)與三五族材料的異質整合。

關鍵字:industrical PC