Imec’s Virtual Fab Underpins Strategies to Reduce the Carbon Footprint of Lithography and Etch (2023.03.29)

At the 2023 Advanced Lithography + Patterning Conference, imec presents a quantitative assessment of the environmental i…

MediaTek Shows The World’s First Live Demos of Wi-Fi 7 Technology (2022.01.26)

MediaTek announced the world’s first live demo of Wi-Fi 7 technology, highlighting the capabilities of its forthcoming W…

Aetina Join Embedded World 2020 with Vision-Critical GPGPU Solution (2020.02.07)

TAIPEI, Taiwan – Aetina Corporation announced that it will demonstrate AI related products in Embedded World 2020. Aetin…

Samsung Brings On-device AI Processing for Premium Mobile Devices with Exynos 9820 (2018.11.14)

Samsung Electronics today announced its latest premium application processor (AP), the Exynos 9 Series 9820, equipped fo…

Samsung Optimizes Premium Exynos 9 Series 9810 for AI Applications (2018.01.04)

Samsung Electronics announced the launch of its latest premium application processor (AP), the Exynos 9 Series 9810. The…

Global AMOLED Panel Production Capacity Set to More Than Quadruple (2017.10.24)

The global production capacity of AMOLED panels -- including both red-green-blue (RGB) OLED and white OLED (WOLED) -- is…

The New Unitech PA720 Rugged Android Handheld Computer Wins iF Design Award for Product Design (2017.03.29)

TAIPEI, Taiwan - Unitech announced today that its newest Enterprise PDA, the PA720, has won the 2017 iF Design Award in …

Amazon Introduces Latest Generation Fire TV Stick in the UK, Germany, and Japan (2017.02.22)

Amazon has announced that the latest generation Amazon Fire TV Stick is now available for customers in the UK, Germany, …

能源產業成就物聯網未來？ (2017.02.02)

由於大量的智慧型電子裝置部署於變電所及配電網路，因此各界經常將能源產業視為實現IoT理所當然的機會與目標。…

多功能嵌入式系統新未來：從Android到Raspberry Pi 3 (2017.01.19)

目前Android幾乎已經成為iOS最大的競爭對手。不過，Android的功能雖然強大，但它需要較大的儲存空間之缺點，確實讓一般開發商卻步。…

Ambarella Introduces 8K SoCs for VR and Drone Cameras (2017.01.09)

Ambarella introduced the H3 System-on-Chip (SoC) for high-end drones and a new generation of video cameras, including 36…

Portwell Announces PEB-2773 3.5" Embedded System Board Utilizing Latest Intel Atom Apollo Lake SoC (2016.11.29)

Portwell announces the release of the PEB-2773 (146mm x 102mm) 3.5" embedded system board based on the Intel Atom proces…

3.5” Intel Celeron N2930 SBCs for Robotics Automation (2016.09.05)

Advantech announces the launch of MIO-6300, a 3.5” (146 x 120 mm) System-on-Chip (SoC) slim SBC that incorporates a quad…

Samsung Starts Mass Production of Its 14nm Exynos Processor (2016.08.30)

Samsung Electronics today announced that it has begun mass production of Exynos 7 Quad 7570, the company’s newest mobile…

Ambarella S5 IP Camera SoC Delivers 4K 10-bit H.265 Video and Multi-Imager Capabilities (2016.04.05)

Ambarella introduced the S5 System-on-Chip (SoC) targeting professional high-quality 4K and multi-imager IP camera desig…

Imec, Cadence Complete Tapeout of First 5nm Test Chip (2015.10.08)

Nano-electronics research center imec and Cadence Design Systems today announced that the companies completed the first …

Optimize Vehicular Applications with AAEON's Latest GENE-BT06 3.5" Subcompact Board (2015.10.02)

To further satisfy the increasing demand for in-vehicle computing capabilities, AAEON launches the latest 3.5” Subcompac…

Acer Introduces its First Gaming 8” Tablet (2015.09.02)

Acer announced its new Predator 8 GT-810 gaming tablet, one of several new gaming devices in Acer’s high-octane Predator…

Asustor Launches the World’s First Intel Braswell Powered NAS (2015.09.02)

TAIPEI, Taiwan — ASUSTOR Inc. has announced the launch of 4 high performance tower model NAS devices.These new models ar…

Intel Introduces 6th Generation Core Processor, Improves Battery Life and Graphics (2015.09.02)

Intel Corporation introduced its 6th Generation Intel Core processor family. The 6th Gen Intel Core processors deliver e…