To further satisfy the increasing demand for in-vehicle computing capabilities, AAEON launches the latest 3.5” Subcompact Board: GENE-BT06.
Being the newest entry into the company’s family of subcompact boards, the focus of this new iteration has shifted from general industrial usage to applications in high shock/ high vibration environments, such as onboard vehicles and inside lifts. A series of specific design features have also been added to complement this shift.
Firstly, the CPU is now located at the solder side of the board and is accompanied by a heat spreader. Compared with the use of a heat sink in previous models, this change reduces vertical space needed while still retaining effective heat dissipation, making it more conducive for usage in confined spaces. The CPU, along with other components such as RAM, is soldered onto the board for a sturdier connection when used in high shock/ high vibration environments.
Observing conditions, such as fluctuating voltages, in vehicles, the board can be powered by a DC voltage with a range of 9 ~ 24V, in addition to the standard input of 12V.A version supporting extended temperature ranges will be forthcoming in the near future.
SKUs featuring dual-core (E3825, N2807) and quad-core (E3845, J1900) CPUs are designed for users demanding various levels of performance. Furthermore, dual display is also provided with the board’s VGA, LVDS, and HDMI interface, while the media being played can be stored using any mSATA device, supported by one of the two PCIe slots.
“The GENE-BT06 was born out of the needs of this ongoing market trend”, said Julie Huang, Product Manager of AAEON’s Embedded Computing Division.“The need for infotainment in vehicles is on the rise and the GENE-BT06 is the ideal solution to support this growing trend”.
