Telink and Andes Announce the TLSR9 SoC with RISC-V Processor (2020.11.03)

TAIPEI, Taiwan - Telink Semiconductor and Andes Technology introduced the new connectivity system on a chip (SoC) for Te…

Bluetooth Modules from u-blox Prove Instrumental in COVID-19 Track and Trace Wearable Devices (2020.09.07)

u-blox has confirmed that its Bluetooth 5 modules are being built into wearable devices that are helping to combat the g…

Samsung Announces Availability of its Silicon-Proven 3D IC (2020.08.13)

Samsung Electronics today announced the immediate availability of its silicon-proven 3D IC packaging technology, eXtende…

M31 Completes the Comprehensive Physical IP Platform on TSMC 22nm Process (2020.07.27)

HSINCHU, Taiwan – M31 Technology announced the completion of a comprehensive physical IP platform on TSMC 22nm process, …

Renesas Extends Bluetooth 5.0 Connectivity to RA Family of 32-Bit MCUs with Arm Cortex-M Core (2020.05.09)

Renesas Electronics introduced the first RA microcontroller (MCU) with an integrated Bluetooth 5.0 Low Energy radio. The…

COVID-19 Outbreak Impacts on Global High-Tech Industry (2020.02.17)

The following analysis shows TrendForce’s investigations of key component and other downstream technology industries, un…

ITRI, Xplova, and Everest Textile Sign Cooperation Agreement on Digital Fitness Platform at CES 2020 (2020.01.08)

The Industrial Technology Research Institute (ITRI), Xplova, and Everest Textile signed an MoU (Memorandum of Understand…

Taiwan Tech Arena Win 13 Innovation Awards at CES 2020 (2020.01.08)

TAIPEI, Taiwan - Under initiative of Ministry of Science and Technology (MOST) of Taiwan, Taiwan Tech Arena (TTA) organi…

2019 Arm Design Contest: Feng Chia University Wins Prize for Smart Wearable Fitness Analysis (2019.11.11)

TAIPEI, Taiwan - Arm in collaboration with Taiwan Semiconductor Research Institute (TSRI) and STMicroelectronics announc…

MediaTek’s 8K DTV SoC in Volume Production on TSMC 12FFC Technology (2019.11.08)

HISNCHU, Taiwan – MediaTek and TSMC today announced that the industry’s first 8K digital TV system-on-chip (SoC) manufac…

2019 Shipment of Flat-Panel Display Driver IC Exhibits Negative Growth, Says TrendForce (2019.10.30)

According to the latest analysis from the WitsView research division of TrendForce, reduced panel shipment is causing th…

2019醫電高峰論壇 台廠借優勢搶進新南向市場 (2019.10.22)

為了讓國內醫療器材產業快速切入新南向的市場需求及通路，以台廠優勢搶攻未來智慧醫院及照護缺口，「2019醫療電子與器材國際高峰論壇」(Medical Electronics & Device in Taiwan Forum, MEDiT)」於…

推升軟性電子應用 工研院辦ICFPE剖析軟性與印製電子最新趨勢 (2019.10.09)

備受矚目與期待的「軟性與印製式電子國際會議」（International Conference on Flexible and Printed Electronics，ICFPE）今年已邁入第十年，工研院將於10月23至25日一連三天於台北…

u-blox Acquires Rigado’s Bluetooth Modules Business and Extends Bluetooth Low Energy Offerings (2019.09.02)

u-blox announced it acquired Rigado’s Bluetooth modules business in an Asset Purchase Agreement. Rigado is a leading pro…

Lextar to Releases New Mini LED Product Series at Touch Taiwan 2019 (2019.08.26)

TAIPEI, Taiwan - Lextar Electronics will release a new series of Mini LED ready for mass production, including I-Mini Bl…

EDOM and PollenTech Further Advance IoT Design Services (2019.08.26)

TAIPEI, Taiwan - EDOM Technology and PollenTech today announced their strategic partnership to enable the delivery of co…

Electronic Chip Mimics the Brain to Make Memories in a Flash (2019.07.17)

Researchers from RMIT University drew inspiration from an emerging tool in biotechnology – optogenetics – to develop a d…

Samsung Introduces Exynos i T100 for Secure and Reliable IoT Devices (2019.05.07)

Samsung Electronics announced a new Internet of Things (IoT) solution, the Exynos i T100, which enhances the security an…

Smallest Data Converters Deliver High Integration and Performance (2019.01.03)

Texas Instruments (TI) introduced four tiny precision data converters, each the industry’s smallest in its class. The ne…

穿戴式裝置上太空：IoT最後的疆界 (2018.12.28)

Dialog的IC為最新和最偉大的穿戴式發明提供所需的能源效率和小構型設計。穿戴式裝置是人與電子之間的橋樑，不論在任何環境 - 包括外太空。…