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TSMC and ARM Set New Benchmarks for Mobile Processor With 16nm FinFET Technology

瀏覽次數:1245

TSMC and ARM today announced the results from a key FinFET silicon validation of the ARM big.LITTLETM implementation, using ARM Cortex-A57 and Cortex-A53 processors on TSMC's advanced 16nm FinFET (16FF) process technology.

Silicon results on 16FF show the "big" Cortex-A57 processor achieving 2.3GHz for sustained mobile peak performance, as well as the "LITTLE" Cortex-A53 processor consuming only 75mW for most common workloads.

The performance improvements are a result of the collaboration between ARM and TSMC to jointly optimize the 64-bit ARMv8-A processor series on FinFET process technologies and build on the successful tape-out of the Cortex-A57 processor on TSMC's 16FF process last year.

Ongoing collaborative efforts are focused on TSMC's 16FF+ process technology which will deliver an additional 11% gain in performance for the Cortex-A57 at the same power as the 16FF process, along with a further 35% power reduction for the Cortex-A53 when running low-intensity applications.

This further increases the dynamic performance range and power savings for big.LITTLE platforms. 16FF+ is scheduled to be delivered by Q4 2014. Early big.LITTLE implementations of Cortex-A57 and Cortex-A53 processors on 16FF+ are supported by ARM POP? IP technology.

"This silicon proof point with ARM Cortex-A57 and Cortex-A53 processors demonstrates the additional benefits in performance and power efficiency that 16nm FinFET technology delivers to big.LITTLE implementations," said Pete Hutton, executive vice president and president, product groups, ARM.

"The joint effort of ARM, TSMC, and TSMC's OIP design ecosystem partners will transform end-user experiences across the next generation of consumer devices and enterprise infrastructure."

"Our long-term collaboration with ARM continues to push advanced technologies that enable market-leading SoCs for mobile, server, and enterprise infrastructure applications worldwide," said Dr. Cliff Hou, vice president, R&D, TSMC.

"TSMC is proud to be the first foundry to validate the ARM big.LITTLE implementation on FinFET, and this achievement demonstrates in silicon the real-world capabilities of next-generation ARMv8 processors on TSMC's advanced FinFET technology."

稀土棋局下的台灣解方:從供應鏈韌性看關鍵礦物合作新契機
特別企劃半導體

稀土棋局下的台灣解方:從供應鏈韌性看關鍵礦物合作新契機

稀土與關鍵礦物已成全球科技競爭與經濟安全的重要戰略資源。面對供應鏈高度集中與地緣風險升高,台灣如何透過國際合作、技術替代、戰略儲備與城市採礦,建立自主且具韌性的關鍵礦物供應體系?

稀土與關鍵礦物已成全球科技競爭與經濟安全的重要戰略資源。面對供應鏈高度集中與地緣風險升高,台灣如何透過國際合作、技術替代、戰略儲備與城市採礦,建立自主且具韌性的關鍵礦物供應體系?

關鍵字:FinFET