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REYAX RY277AI Reduces Development Time to Integrate 3G and GNSS in a Tracking Solution

瀏覽次數:1506

REYAX Technology developed a new industrial high-integration 3G GNSS tracking platform, the REYAX RY277AI which is fully based on technology from u-blox, a global leader in wireless and positioning modules and chips,

"Our vehicle tracking platforms are dependent on highly accurate position data to deliver the performance crucial to meet the demands of our customers. u-blox’s highly reliable products as well as a flawless technical support were convincing," said Ritchie Chang, General Manager of REYAX Technology. "u blox’s MAX M8C positioning module and SARA U270 cellular module were the right choice for this new platform," he added.

RY277AI is designed for 3G telematics applications, in particular vehicle tracking, fleet management and insurance box. With both MAX-M8C and SARA U270 modules embedded, it also benefits from two of u blox’s unique GNSS and wireless technology services. With AssistNow, Assisted GNSS (A-GNSS) accelerates the calculation of a position by delivering satellite data to the GNSS receiver via wireless networks or the Internet, also ensuring faster TTFF (Time To First Fix).

CellLocate, another of u-blox’s trademarked technologies, matches cellular positioning data with previously successful GNSS fixes in shielded environments such as indoors. This is especially useful in case of jammed GNSS signals and in M2M applications. Additionally, u-blox’s Nested Design enables hosting of next generation wireless and positioning modules on the same PCB.

"We are excited about this co-operation with REYAX Technology, the recognized leader in telematics tracking systems. REYAX based solutions make full use of u-blox's advanced positioning and cellular technologies to enhance vehicle tracking. This solution is an answer to the growing encouragements by the Taiwanese government to promote IoT/M2M applications and whose vision we share." explained Ming Chiang, Country Manager of u-blox Taiwan.

RY277AI comes in an LGA package, with a dimension of 70mm x 30mm x 7mm, and an operating temperature of -40~+85° C.

稀土棋局下的台灣解方:從供應鏈韌性看關鍵礦物合作新契機
特別企劃半導體

稀土棋局下的台灣解方:從供應鏈韌性看關鍵礦物合作新契機

稀土與關鍵礦物已成全球科技競爭與經濟安全的重要戰略資源。面對供應鏈高度集中與地緣風險升高,台灣如何透過國際合作、技術替代、戰略儲備與城市採礦,建立自主且具韌性的關鍵礦物供應體系?

稀土與關鍵礦物已成全球科技競爭與經濟安全的重要戰略資源。面對供應鏈高度集中與地緣風險升高,台灣如何透過國際合作、技術替代、戰略儲備與城市採礦,建立自主且具韌性的關鍵礦物供應體系?