TAIPEI, Taiwan — As the debut of iPhone 6 comes closer, which means the high season of IC Substrate, FPC, and HDI firms is drawing near. Among the supply chain of application processor, FPC, and HDI, Ibiden from Japan got the most orders, Unimicron and Kinsus Interconnect Technology from Taiwan are also part of supply chains of iPhone 6, and also proves that the fingerprint authentication system of Taiwan is in the leading status.
Source said that by Q4 of 2014, iPhone 6 will be shipped out 100 million units, as well as iWatch will be unveiled in October and sold 30 million units, both are growth drivers of its supply chains.
Unimicron returned to iPhone's supply chain this year, helping its performance get better. “In Q3 and Q4, our revenue will be increased comparing to Q1 and Q2. Any-layer HDI is in tight supply, it will be better in Q3 and Q4, keeping getter better in 2015 and 2016.” said Ceng Zi-zhang, Chairperson of Unimicron.
Intel is another big customer of Unimicron, “We are looking forward to the new firm of FC-BGA, and we believed that this technology will be mainstream in the coming two or three years, and we will have more customers.” Ceng Zi-zhang added.
Actually, Kinsus isn't a supplier of Apple's A8 processor, but indirectly received some orders from Apple, including its fingerprint authentication system. Each of FC CSP, System in Package (SiP), FC-BGA, and Wire Bonding occupied 25 percent of the product line.
Moreover, Kinsus rolled out the Coreless technology, which reduced the cost and reached ultra-light performance that can be applied in entry to mid-tier smartphones.
