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Intel Edison Module Offers Google Brillo Support

瀏覽次數:1438

Intel announced today that its Intel Edison compute module is one of the first platforms to support Brillo, which Google released source code for today via an invitation program.

Brillo and Weave form a solution for building connected devices. Incorporating aspects of the Android platform, Brillo brings security, local and inter-device service compatibility, and a modular approach to building system components.

Sitting on top of Brillo, Weave is an open communications protocol that supports discovery, provisioning, and authentication so that devices can connect and interact with one another, the Internet, and your mobile platforms.

Verified functionality of Brillo with the Intel Edison module now results in a versatile and secure IoT platform for scaling your projects beyond proofs of concept. The built-in and pre-certified connectivity of the Intel Edison module, as well as the small form factor, open the door for new products and services that seamlessly connect with other devices.

Newegg will be offering a Brillo-compliant solution built upon the Intel Edison kit for Arduino. Intel expects to support Brillo on additional SoCs (system-on-chip) and IoT maker boards in the future.

稀土棋局下的台灣解方:從供應鏈韌性看關鍵礦物合作新契機
特別企劃半導體

稀土棋局下的台灣解方:從供應鏈韌性看關鍵礦物合作新契機

稀土與關鍵礦物已成全球科技競爭與經濟安全的重要戰略資源。面對供應鏈高度集中與地緣風險升高,台灣如何透過國際合作、技術替代、戰略儲備與城市採礦,建立自主且具韌性的關鍵礦物供應體系?

稀土與關鍵礦物已成全球科技競爭與經濟安全的重要戰略資源。面對供應鏈高度集中與地緣風險升高,台灣如何透過國際合作、技術替代、戰略儲備與城市採礦,建立自主且具韌性的關鍵礦物供應體系?

關鍵字:makers.IoT