TAIPEI, Taiwan － Advanced Semiconductor Engineering, Inc (ASE), announced it will be showcasing its System in Package (SiP) solutions in consumer and automotive applications at SEMICON China, scheduled to take place in Shanghai, China, from March 15 to 17, 2016.
SiP technology enables multiple semiconductor chips and passive components to be integrated within a smaller and more compact module without compromising the functionality and performance of the entire package or module.
Hence, SiP can be ideally applied to many of today’s consumer technologies that require heterogeneous integration of numerous IC functions such as RF, processor, memory, sensors, power management, multimedia, and more, within very tight space constraints.
To better serve the fast-growing IoT segment, ASE has evolved its business model by combining its technologies in wire bonding, wafer level, fan-out, flip chip, 2.5D/3D, substrates and embedded IC packaging with USI’s module level assembly to establish a strong leadership in SiP.
ASE has also created a cohesive ecosystem for its SiP platform that included a key announcement with Inotera Memories Inc (April 7, 2014) on foundry service for 2.5D silicon interposer and TDK Corporation (May 8, 2015) for proprietary embedded substrate manufacturing.
The collaboration within the supply chain has led to the development of a world class manufacturing technology that can be used in embedded solutions within smartphones, wearables, homes, connectivity and sensor applications.
ASE’s exhibits on display will include mesh lighting (smart lighting) that can be controlled through an iPad, environmental sensors, logistics and M2M tracking using 4G LTE SiP, mobile connectivity in cars, wearables and ASE’s advanced packaging technology portfolio.
Attendees will have the opportunity to see how SiP solutions are implemented into a variety of applications, including smart living, automotive communications and electronics, data management and diagnostic devices in healthcare.
