Hsinchu, Taiwan – eMemory announced that it has received TSMC’s Open Innovation Platform (OIP) IP Partner Award again. The selection was made based on comprehensive consideration and judgment. TSMC has honored eMemory with this award since 2010, rewarding eMemory’s commitment to offering comprehensive logic NVM IPs in a variety of TSMC processes.
“eMemory’s comprehensive IPs have consistently received high appraisals from our mutual customers,” said Suk Lee, TSMC Senior Director of Design Infrastructure Marketing. “This award recognizes eMemory’s ability to provide high-quality logic NVM IPs as well as excellent technical support and customer service.”
eMemory President Rick Shen said, " We are honored to win the TSMC Open Innovation Platform's Partner of the Year Award in the categories of Specialty Embedded Memory IP again this year. With our long-term partner TSMC, we will continue to devote our efforts to providing flexible logic NVM solutions with user-friendly interfaces across a wide range of process platforms."
The eMemory partnership with TSMC began in 2003 and has seen the implementation of logic NVM solutions including NeoBit, NeoFuse, NeoEE, and NeoMTP across a range of TSMC process platforms. eMemory’s efforts to develop NVM solutions in advanced process have resulted in significant achievements this year, with the NeoFuse IP completing qualification in the 16FF+ process and currently undergoing qualification in the 16FFC process.
To date, over 260 of eMemory’s silicon IPs have been deployed on TSMC’s Open Innovation Platform. eMemory has completed more than 1,000 new tape-outs, and a total of nearly 8 million embedded eMemory silicon IP wafers have been employed in various TSMC manufacturing process platforms for a broad range of applications, including IoT, smartphone, automotives, and consumer electronics.
