Microsemi Corporation announced qualification of its AEC-Q100 grade 1 automotive-grade field programmable gate arrays (FPGAs). In addition to outlining the criterion for electronic components to ensure that end systems meet automotive reliability levels, the grade 1 industry standard specification validates Microsemi's IGLOO2 FPGAs as offering the highest junction temperature in its class─up to an impressive 125 degrees ambient (135 degrees Celsius junction).
"Our automotive-grade FPGAs offer the highest reliability and security in critical under-the-hood applications to ensure the safety of our customers' design, data and hardware," said Bruce Weyer, vice president and business unit manager at Microsemi.
"In addition to providing the highest operating temperature, the IGLOO2 AEC-Q100 grade 1 FPGAs also provide the lowest total power in their class, enabling automotive designers to maximize their dynamic power budget in compact and high performance systems to deliver highly differentiated automotive solutions at the lowest total cost of ownership."
Microsemi's IGLOO2 FPGA devices, which also met industry standard specifications for grade 2 temperature range earlier this year along with Microsemi's SmartFusion2 system-on-chip (SoC) FPGAs, offer customers single event upset (SEU) immunity from neutron-induced firm errors, helping them achieve the zero defect rate essential for the automotive industry, as well as the company's security features and secure supply chain.
These features address the most important design concerns for today's automotive designers. Microsemi's newly qualified devices are also the most suitable alternate to ASICs providing a low power, cost-effective, secure and reliable solution for automotive applications including advanced driver assistance systems (ADAS), vehicle-to-vehicle/vehicle-to-everything (V2V/V2X) communication and electric/hybrid engine control units.
Demand for high reliability in critical applications, ensuring zero-defect and tamper-free applications, continues to grow rapidly in the automotive industry. With an increase in security mandates amongst its customer base, Microsemi is the only vendor offering automotive-grade FPGAs at higher junction temperature, along with best-in-class security in low power and small footprint packages.
"The automotive market for semiconductors is forecast to grow to $32.3 billion in 2016, from $30.3 billion in 2015, an increase of almost 7 percent," commented Colin Barnden, principal analyst at Semicast Research. "In comparison, we see the market for semiconductors in vehicle connectivity and ADAS growing at more than 20 percent in 2016.
Microsemi's SmartFusion2 and IGLOO2 devices bring world class security features to the automotive industry and will address several challenges such as hacking, malicious tampering and data theft faced by system designers in creating safe and secure systems for the connected automobiles of the future."
Product Demonstrations in Booth W2-78 at CAR-ELE JAPAN
Microsemi will be showcasing its automotive-grade FPGAs at the upcoming CAR-ELE JAPAN International Automotive Electronics Technology Expo Jan. 13-15, 2016, with product demonstrations offered in Microsemi's booth, W2-78. The event, which will be held at Tokyo Big Sight in Tokyo, Japan, highlights a variety of industry-leading automotive electronics technologies such as components, materials, software, manufacturing equipment and testing technologies.
