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STMicroelectronics Unveils World’s Fastest 50W Qi Wireless-Charging IC (2020.11.06)
STMicroelectronics has introduced the world’s fastest Qi wireless charging IC, STWLC88. Delivering as much as 50W of power, the new device enables consumers to charge smartphones, tablets, laptops, and other personal electronic devices without cables as safely and nearly as quickly and efficiently as they could by plugging them in |
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eMemory NeoFuse IP Qualified on GLOBALFOUNDRIES Advanced High Voltage Platform for OLED Applications (2020.11.06)
HSINCHU, Taiwan – eMemory announced today its NeoFuse IP has been qualified on GLOBALFOUNDRIES (GF) 28HV platform in response to the rising demand for Organic Light Emitting Diode (OLED) display applications. The announcement was made at GF’s China Global Technology Conference (GTC) |
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Acer Reports Q3 2020 Results: Highest in Nearly Ten Years (2020.11.06)
TAIPEI, Tawan - Acer announced its financial results for the third quarter of 2020: consolidated revenues were NT$80.06 billion, up 27.3% year-on-year (YoY); gross profits were NT$8.40 billion with 10.5% margin; operating income was NT$2 |
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DDR5 Era to Officially Begin in 2021, Says TrendForce (2020.11.03)
As the current mainstream solution for PC DRAM and server DRAM, both of which share the same roots in IC design, DDR4 reached a penetration rate of more than 90% in each of the above two categories in 3Q20, according to TrendForce’s latest investigations |
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AUO Partners with NHRI to Release an Innovative Smart System for Comprehensive Senior Healthcare (2020.11.03)
HSINCHU, Taiwan – The trend of an aging society in recent years has driven the increasing demand for smart healthcare. AUO, specializing in the general health industry, teams up with NHRI (National Health Research Institutes) to join “The Cares 2020” for the first time |
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Telink and Andes Announce the TLSR9 SoC with RISC-V Processor (2020.11.03)
TAIPEI, Taiwan - Telink Semiconductor and Andes Technology introduced the new connectivity system on a chip (SoC) for Telink’s latest product line, the TLSR9 series. Powered by the 32-bit AndesCore D25F, the TLSR9 series is designed for the next generation of hearables, wearables, and other high-performance IoT applications |
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Kioxia to Expand 3D Flash Memory Production Capacity (2020.10.29)
Kioxia Corporation today announced it will begin construction of a state-of-the-art fabrication facility (Fab7) at Yokkaichi Plant in Mie Prefecture, Japan to expand production of its proprietary 3D Flash memory BiCS FLASHTM. The construction of Kioxia Corporation’s Fab7 facility is expected to commence in the spring of 2021 |
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HOLTEK New BA45F6720/6740/6746 CO/GAS Detector MCUs (2020.10.29)
Holtek announced the release of its new CO/GAS detector MCUs, the BA45F6720/6740/6746 series. The devices include a fully integrated CO/GAS detection AFE, a 2.2V/2.5V/3.0V LDO, temperature sensor and LCD/LED driver display. The BA45F6720 is suitable for use in CO/GAS detection modules, the BA45F6740 is suitable for use in LED display CO/GAS detectors and the BA45F6746 is suitable for LCD display CO/GAS detectors |
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UMC and US Department of Justice reach Plea Agreement on Trade Secret Case (2020.10.29)
HSINCHU, Taiwan - United Microelectronics today pleaded guilty to one count of receiving and possessing a stolen trade secret, and agreed to pay a fine of $60 million USD.
UMC’s plea and Plea Agreement resolve a 2018 trade secrets case brought against UMC by the U |
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AAEON Receives four Taiwan Excellence Awards for 2021 (2020.10.29)
AAEON is honored with receiving the 29th Taiwan Excellence Award for 2021. Four AAEON products are recognized this year for their innovation and design to continue pushing AI and edge computing; the BOXER-6641, BOXER-6842M, BOXER-8221AI and BOXER-8521AI |
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Power Integrations’ New MinE-CAP IC Reduces Volume of AC-DC Converters by Up to 40% (2020.10.28)
Power Integrations announced the MinE-CAP IC for high power density, universal input AC-DC converters. By halving the size of the high-voltage bulk electrolytic capacitors required in offline power supplies, this new type of IC enables a reduction in adapter size of up to 40% |
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Digital Show Highlights Innovative Solutions from Taiwan’s Hardware Manufacturers (2020.10.28)
TAIPEI, Taiwan - Six winners of the Taiwan Excellence Award unveiled their groundbreaking advances for the hardware manufacturing industry at the Taiwan Excellence Hardware Showcase, a digital event held on Friday, October 23, in Taipei, Taiwan, to industry professionals around the globe |
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DRAM Price Erosion Expected Through the End of 2020, Says IC Insights (2020.10.28)
IC Insights’ October Update to The McClean Report showed the monthly average selling price (ASP) of DRAM started on a steep downward trend in the second half of 2018 that eventually bottomed out at $3.04 in December 2019. DRAM prices rebounded in the first half of 2020 as memory demand grew for personal and enterprise computing systems after the Covid-19 virus forced a rapid and dramatic shift to online-based education |
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AMD Set to Become Fourth Largest IC Design Company After Xilinx Acquisition, Says TrendForce (2020.10.28)
AMD announced that it had reached an agreement with leading FPGA manufacturer Xilinx to acquire the latter for US$35 billion. Should the acquisition proceed as planned, AMD will greatly increase its influence across industries such as 5G |
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Kingston, ADATA, Tigo Take Top Three of SSD Module Makers (2020.10.27)
The total worldwide shipments of branded SSDs bound for the channel (retail) market in 2019 reached 131 million units, showing an increase of almost 60% from 2018, according to TrendForce's latest investigations. This result also indicated a further and substantial growth in SSD adoption |
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Toshiba Announces Updated 4TB, 6TB and 8TB Enterprise Capacity HDD Models (2020.10.27)
Toshiba announces the Toshiba MG08-D Series HDDs, designed for a wide variety of business-critical applications, such as email and CRM (Customer Resource Management), data analysis for business intelligence, small-medium business servers, and data-retention and compliance archiving |
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HOLTEK New BA45F6720/6740/6746 CO/GAS Detector MCUs (2020.10.26)
Holtek wishes to announce the release of its new CO/GAS detector MCUs, the BA45F6720/6740/6746 series. The devices include a fully integrated CO/GAS detection AFE, a 2.2V/2.5V/3.0V LDO, temperature sensor and LCD/LED driver display |
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u-blox Announces High Performance NORA-B1 Bluetooth Module for Advanced Applications (2020.10.26)
u-blox announced the NORA-B1 Bluetooth module, the newest member of its short range radio portfolio. Based on Nordic Semiconductor’s latest nRF5340 Bluetooth low energy chipset – the first to host a powerful Arm Cortex M33 dual core MCU – NORA-B1 is designed to meet the needs of performance-oriented applications in areas such as industrial, medical, and smart building and smart city markets |
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Nuvoton NuMaker-IoT-M263A Developing Board Speeds Up IoT Device Design Cycle (2020.10.26)
HSINCHU, Taiwan - Nuvoton Technology expanded its IoT platform based on the NuMicro Family product portfolio. The NuMaker-IoT-M263A board is an IoT device development board. With the IoT software development kit provided by NuMicro series products, it supports a wide range of software development work to ensure low power consumption and high-security IoT device design |
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Renesas and Sequans to Collaborate on 5G/4G Cellular IoT (2020.10.23)
Renesas Electronics and Sequans Communications will partner to develop IoT modules based on Sequans’ Monarch LTE-M/NB-IoT platform. The modules are designed to provide IoT companies with an integrated microcontroller (MCU) plus connectivity platform that streamlines and simplifies IoT system design for many applications, including smart city, smart home, and industrial IoT |
