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X-PITCH 2022 is Open for Applications (2022.07.04)
KAOHSIUNG, Taiwan - In the X Games for Startups, contestants go through a series of high-intensity pitch challenges (15-second, 60-second and 3-minute pitch) to win awards and investments. In the past, the events were held in skyscraper elevators and self-driving vehicles |
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ST and Sensory Collaborate to Enable Mass-market Adoption of Embedded Voice (2022.07.04)
STMicroelectronics and Sensory Inc have announced a collaboration that will enable the STM32 microcontroller (MCU) user community to develop and prototype intuitive voice-based user interfaces for a wide range of smart embedded products |
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AUO Recognized with Manufacturing Leadership Awards (2022.07.04)
Hsinchu, Taiwan – AUO announced that it has been recognized by the Manufacturing Leadership Awards (MLA) in categories of Digital Network Connectivity as well as AI and Machine Learning, and especially honored the High Achiever in Sustainability and the Circular Economy category by the National Association of Manufacturers (NAM) in the US |
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MediaTek to Open New IC Design Center at Purdue University in Indiana (2022.06.29)
MediaTek announced their commitment to accept a state transition assistance package from the Indiana Economic Development Commission (IEDC) to support its very first Midwest semiconductor chip design center in West Lafayette, Indiana |
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GlobalWafers to Establish a New 300mm Wafer Fab in the US (2022.06.29)
GlobalWafers announced on July 27th that it is going to establish a 300mm wafer fab in the Taxes Sherman, United State. The company projected that it will start mass production in 2025 to service its big customers including TSMC, Intel, and Samsung |
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HOLTEK New BS84C12CA High Noise Immunity Enhanced Touch A/D MCU (2022.06.29)
Holtek announced the release of its new Enhanced Touch A/D Flash MCU, the BS84C12CA. This new device incorporates all the excellent noise immunity features of the previous BS84C12C series and additionally has full pin compatibility with the BS84C12x |
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Imec Reveals Backside Power Delivery with Buried Power Rails for Back (2022.06.28)
At the 2022 IEEE VLSI Symposium on Technology and Circuits, imec presented the first experimental demonstration of a routing scheme for logic ICs with backside power delivery enabled through nano-through-silicon-vias (nTSVs) landing on buried power rails (BPRs) |
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Microsoft’s MR Aids TMUH to Develop Spinal Endoscopic Surgery (2022.06.28)
TAIPEI, Taiwan - Under the COVID-19 variant pandemic, every related personal need to do the COVID-19 test before surgery in the hospital, and people commonly worry about the risk of being infected, which results in some unurgent surgery and outpatient surgery being canceled |
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Micro LED Startup PlayNitride Showcases COC Mass Transfer Process (2022.06.24)
PlayNitride, a Taiwanese Micro LED Startup, held its IPO announcement press conference yesterday(6/23). The company opened its main stock holders and supply partners for the first time, and described its core technologies and application fields publicly |
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ITRI and TSMC Announces a New SOT-MRAM Technology at VLSI 2020 (2022.06.23)
TAIPEI, Taiwan – Taiwan’s ITRI(Industrial Technology Research Institute) announced a world-leading SOT-MRAM technology which is co-developed with TSMC. Apart from this, ITRI also cooperated with National Yang Ming Chiao Tung University(NYMC) to develop a new MRAM which has a wide operating temperature of 400 degrees Celsius |
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IC Insights：Top 10 analog IC suppliers for 2021 (2022.06.13)
With analog sales of $14.1 billion and 19% marketshare, Texas Instruments maintained its firm grip as the world’s leading supplier of analog devices in 2021. TI’s 2021 analog sales increased nearly $3.2 billion or 29% compared to 2020, according to IC Insights’ 2Q22 Update to The McClean Report that was released in May |
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u-blox Announces the u-blox MAYA-W2 tri-radio module (2022.05.19)
Thalwil, Switzerland – u-blox Announces the u-blox MAYA-W2 tri-radio module. Supporting Wi Fi 6, Bluetooth low energy (LE) 5.2, and IEEE 802.15.4 (Thread and Zigbee) on a compact form factor, the module brings Wi-Fi 6 technology to industrial and consumer mass-market applications in industrial automation, smart building & energy management, healthcare, smart home, and many other applications |
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Release its new integrated PIR/Microwave AFE and LDO Flash MCU (2022.05.03)
Holtek Announces the release of its new integrated PIR/Microwave AFE and LDO Flash MCU, the BA45F6640. By only adding an external PIR sensor or a microwave module, a human body motion detection function can be implemented. The device has a long detection range of up to 12 meters and also has anti-RF interference making it suitable for use in Internet of Things products |
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Imec Ramps Up the Development of the High-NA EUV Patterning Ecosystem (2022.05.03)
LEUVEN,Belgium— At the 2022 SPIE Advanced Lithography and Patterning Conference, imec presents significant progress in preparing the High-NA patterning ecosystem for the imec-ASML Joint High-NA Lab, which will be centered around the first 0 |
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Pulsonix PCB Design Adds 3D Collision Detection (2022.04.21)
Tewkesbury, UK– Pulsonix Announces the release of Pulsonix version 12.0, which adds new capabilities, speed improvements, and requested usability enhancements.
“Version 12.0 offers a significant step up for our users in the areas of the PCB design process that they say would benefit them the most, ” said Bob Williams, marketing director for Pulsonix |
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Avalue Launches 3-in-1 M.2 Expansion Card (2022.04.21)
TAIPEI, TAIWAN–Avalue Technology Launches latest peripheral product EPM-1607 with PCIe 3-in-1 M.2 2280/2260/2242 may be split according to requirements, can expand four independent RS-232 serial ports, and ultra-low power consumption |
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Phison Held opening ceremony of the affiliated parking space (2022.04.09)
Phison Electronics held the opening ceremony of the affiliated parking tower of Phison R&D Building on Apr, 8 (Taipei time). This parking tower not only achieves the goal of all Phison employees having a parking space, but also becomes a new welfare indicator for Guangyuan Science Park (廣源科學園區) in Zhunan, Miaoli |
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Kioxia Introduces 2nd Generation SSDs Designed With PCIe 5.0 (2022.03.24)
The first vendor to offer a drive designed with PCIe 5.0 interface technology, Kioxia Corporation announced that it has built on this achievement by introducing its 2nd generation SSDs.
The company’s new KIOXIA CD8 Series data center NVMe SSDs (“CD8 Series”) are optimized for hyperscale data center and enterprise server-attached workloads, and utilize PCIe 5 |
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Phison Electronics Passes ISO 26262 Certification (2022.03.12)
San Jose, Calif- Phison Electronics Corp Announces that it has passed the automotive functional safety development process certification, ISO 26262.
The automotive storage market has always been a major growth driver for the NAND storage manufacturers |
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ICInsight:2022 to Mark 20% Growth for the Foundry Market (2022.03.12)
IC Insights’ Forecast for the foundry market through 2026 was part of its recently released 1Q Update to the 2022 McClean Report. The Update also included analyses of the top-25 2021 semiconductor suppliers, semiconductor industry capital spending, IC industry capacity, the automotive IC market, and detailed forecasts for the DRAM, flash, MCU, MPU, and analog IC product segments |
IEEE1394 is a common interface standard that allows interconnected communication between computers and peripheral equipment. So rapidly the efficiency of the transmission speed, it is often applied in connection high density of signal transmission, the transmission quantity of peripheral devices.