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Covestro Relies on Circulating Process Water (2021.08.03)
Covestro intends to increase the circular use of process water in the future. To this end, the company is focusing specifically on research and development and is participating in the new RIKovery research project (funding code 02WV1569) |
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HOLTEK HT32 Series Conforms to the UL/IEC 60730-1 Class B Software Security Certification (2021.08.03)
Holtek announced that its function library for the HT32F65xxx series of MCUs has obtained UL/IEC 60730-1 Class B motor control software security certification. By directly using this library, designers can quickly pass the motor controller UL/IEC 60730-1 Class B software security certification, resulting in greatly reduced software certification cycle times |
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u-blox wins Chinese court ruling Against Techtotop in Patent and Copyright Infringement Suits (2021.08.02)
u-blox announced that the Hangzhou Intermediate People’s Court has ruled in favor of u-blox in separate copyright and patent infringement lawsuits the company filed against Techtotop Microelectronic Technology Co. Ltd. (TTT) |
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First Dual-output Automotive Dead Reckoning Module Qualified for Operation up to105 °C (2021.07.20)
u-blox is introducing a series of automotive-grade positioning modules that are operational up to 105 °C. The NEO-M9L modules and the M9140-KA-DR chip are built on the robust u-blox M9 GNSS platform and use dead reckoning techniques to provide accurate position data when satellite signals are compromised or unavailable |
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STMicroelectronics and Feig Collaborate on Contactless Product Personalization (2021.07.14)
STMicroelectronics and Feig Electronic have combined their RFID know-how in a time-saving logistics solution that can help cut numerous costs and enhance flexibility for vendors of high-tech products such as smart industrial, consumer, and medical devices |
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MIKROE’s Universal FUSION Development Board for All Microchip PIC MCU (2021.07.14)
MikroElektronika (MIKROE), the embedded solutions company that dramatically cuts development time by providing innovative hardware and software products based on proven standards, has launched FUSION for PIC v8, offering universal support for PIC, dsPIC, PIC24, PIC32 microcontrollers on one board |
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Antenova Introduces Lutosa, High Performing Antenna for Small Devices on LTE and 5G Networks (2021.07.11)
Antenova Ltd, UK-based manufacturer of antennas and RF antenna modules for M2M and the IoT, is announcing a compact high performing antenna for the 5G bands worldwide, including LTE band 74 1420-1520MHz and 617-698MHz.
Lutosa is a flexible antenna measuring 95 x 15 x 0 |
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SGET Announces New Chairman and Sets Sail for a New Decade (2021.07.11)
SGET, an international not-for-profit association of companies and organizations that collaboratively develop independent specifications for embedded computer technology, held its triennial management board election. The group elected a new chairman and re-elected four members of the board to lead the association through 2024 |
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DKSH Partners with Life Science Innovator Nicoya in Asia (2021.07.01)
DKSH Business Unit Technology has entered into an exclusive partnership with Nicoya, an innovative manufacturer of SPR instruments, headquartered in Kitchener, Canada. DKSH will provide marketing, sales and after-sales services support in selected markets across Asia, including Indonesia, Malaysia, Philippines, Taiwan, Thailand, Singapore and Vietnam |
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STMicroelectronics and Metalenz Partner to Transform Optical Sensing (2021.07.01)
STMicroelectronics and Metalenz Inc., the pioneer in meta-surface design and commercialization, today announced a co-development and license agreement that will see ST develop manufacturing processes for Metalenz’s meta-optics technology for next-generation smartphones, consumer devices, healthcare, and automotive applications |
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HOLTEK New HT66F2050/HT66F2040 High Functional Integration Low Pin Count MCU (2021.07.01)
Holtek announces the release of its new high functionally integrated, low pin count Flash MCUs, the HT66F2050 and HT66F2040. The devices have a wide operating voltage range from 1.8V to 5.5V, a 1ms quick start function and small size QFN package types |
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u-blox Presents Bluetooth AoA Kits for High Precision Indoor Positioning (2021.07.01)
u-blox has announced the release of two “explorer kits” aimed at letting product developers evaluate the potential of Bluetooth direction finding and high precision indoor positioning. Designed for low power consumption, simple deployment |
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Pervasive Displays Adds Rugged EPDs to its Product Portfolio (2021.06.18)
TAINAN CITY, Taiwan – Pervasive Displays, recognized specialist in the development and supply of e-paper displays (EPDs), has further expanded the range of potential use cases that its products can support through introduction of the new Armor offering |
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MicroSys Introduces World’s First System-on-Module with the NXP S32G274A Processor (2021.06.18)
MicroSys Electronics announces the world’s first System-on-Module (SoM) with NXP Semiconductors S32G274A processor. The miriac MPX-S32G274A SoM comes with quad Arm Cortex-A53 cores plus triple Arm Cortex-M7 dual-cores and combines ASIL D safety and hardware security with more than 10 times the real-time performance and networking throughput of NXP’s previous automotive gateway devices |
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Startups from 21 Countries Showcase Deep Tech Innovations at #InnoVEXVirtual (2021.06.16)
TAIPEI, Taiwan - Startups are the key to technology development, and they are the driver for industry transformations and evolutions. In COMPUTEX 2021 Virtual, the event organizer, TAITRA, has dedicated a special hall for #InnoVEXVirtual |
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Samsung Starts Mass Production of LPDDR5 Multichip Package (2021.06.16)
Samsung Electronics announced that it has begun mass producing its latest smartphone memory solution, the LPDDR5 UFS-based multichip package (uMCP). Samsung’s uMCP integrates the fastest LPDDR5 DRAM with the latest UFS 3.1 NAND flash, delivering flagship-level performance to a much broader range of smartphone users |
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DesignSpark Integrates SnapEDA to Help Engineers Design-in Millions of Electronic Components (2021.06.15)
Today, SnapEDA, the first search engine for electronics design, and DesignSpark, an online design community and resource centre for design engineers, are launching a new collaboration to help engineers design faster, regardless of which PCB design tool they use |
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Samsung Starts Mass Production of Industry’s Smallest 0.64μm-pixel Mobile Image Sensor (2021.06.10)
Samsung Electronics today introduced the industry’s first 0.64-micrometer (μm)-pixel image sensor, the 50-megapixel (Mp) Samsung ISOCELL JN1. Equipped with the latest pixel technologies such as enhanced ISOCELL 2.0, Smart-ISO and Double Super PDAF, the JN1 can capture more vivid images on the industry’s smallest 50Mp mobile sensor |
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Zeitfracht Acquires Sauter Feinmechanik (2021.06.09)
Zeitfracht Group acquires the system supplier of machine tools SAUTER Feinmechanik. Being a family-owned company from Metzingen, Germany, SAUTER is the world market leader for tool turret technology.
With its motor spindles, tooling, automation solutions and rotary tables, SAUTER is also one of the leading companies in the areas of tool and workpiece carrier systems |
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eMemory and PUFsecurity Join DARPA Toolbox Initiative (2021.06.09)
HSINCHU, Taiwan – eMemory today announced a partnership agreement with the U.S. Defense Advanced Research Projects Agency (DARPA) to enable furthering of accelerated technology innovation for the agency’s programs.
The agreement makes eMemory’s NeoFuse |
ITU's main job is to develop a wireless transmission equipment specification, winged communications, maritime communications, such as cell phones, satellite communication systems, wireless transmission equipment, such as radio and television,