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Astera Labs Expands Focus to Deliver Purpose-Built Solutions Addressing Connectivity Bottlenecks (2021.03.14)
Astera Labs announces its expanded focus to address system-wide performance bottlenecks in data-centric applications. The new Aries Compute Express Link (CXL 2.0) Smart Retimer portfolio (PT5161LX, PT5081LX) for low-latency CXL |
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Toshiba Releases 650V Super Junction Power MOSFETs in TOLL Package (2021.03.14)
Toshiba has launched 650V super junction power MOSFETs, TK065U65Z, TK090U65Z, TK110U65Z, TK155U65Z and TK190U65Z, in its DTMOSVI series that are housed in a TOLL (TO-leadless) package. Volume production shipments start today.
TOLL is a surface-mount package that has an approximately 27% smaller footprint than the usual D2PAK package |
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New Autodesk Fusion 360 App from SnapEDA Makes PCB Part Libraries a Snap (2021.03.12)
SnapEDA is releasing the SnapEDA for Autodesk Fusion 360 app in collaboration with Autodesk.
This new app integrates SnapEDA’s database directly within Fusion 360, enabling electronics engineers and designers to search and place millions of electronic component models - including symbols, footprints and 3D models - directly within the Fusion 360 environment |
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WL-SIQW – High Efficiency Infrared Light Source (2021.03.03)
Würth Elektronik complements its infrared product range with the new WL-SIQW SMT Infrared QFN LED Waterclear product series. The LEDs in Quad Flat No Leads (QFN) format are available in 2720, 3535 and 3737 packages with different radiant intensities from 125 to 800 mW/sr and in 90°, 120° or 150° beam angles |
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Global IT Spending to Jump by $228B and hit $3.92T in 2021 (2021.03.03)
The COVID-19 crisis forced companies and organizations across the globe to speed up the digitalization of their business, as remote working and distance learning became the new normal amid the ongoing lockdown.
The surge in the use of digital solutions and services abated the pandemic’s negative effect on IT spending, which still dropped to just under $3 |
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Kioxia Establishing A New 6th-Gen 3D Flash Memory Factory (2021.02.25)
Kioxia Corporation held a groundbreaking ceremony for its state-of-the-art semiconductor fabrication facility (Fab7) at Yokkaichi Plant in Mie Prefecture, Japan. The facility will be one of the most advanced manufacturing operations in the world, dedicated to production of its proprietary 3D flash memory BiCS FLASH |
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PICMG Announces Official Ratification of COM-HPC Specification (2021.02.25)
PICMG announces that COM-HPC has been approved and ratified, and is now available for public download and distribution.
"Twenty-six industry-leading companies worked together diligently and cohesively over a span of five years”, said Christian Eder, the COM-HPC Working Group Chair |
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SRG-3352C: The Intelligent Solution for Edge Networks (2021.02.25)
AAEON announces the SRG-3352C Compact Edge IoT Gateway System. The SRG-3352C brings reliable, cost effective gateway operations with expandability and wireless communication support designed to quickly deploy edge networks in a variety of environments |
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Dirac Brings High-quality Audio to New FUJITSU Notebook LIFEBOOK U9311 and U9311X (2021.02.17)
Swedish digital audio pioneer Dirac announced that Fujitsu’s LIFEBOOK U9311 and U9311X business laptops, produced by Fujitsu Client Computing Limited (Kawasaki, Japan) and sold by Fujitsu Limited (Kawasaki, Japan), now include Dirac audio technology to deliver an immersive sound experience with upgraded sound quality for various content and use cases |
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ExpressPCB Announces ExpressSCH Plus and ExpressPCB Plus 3.0 with SnapEDA Library (2021.02.17)
ExpressPCB announced the release of its new Plus PCB Design Suite (ExpressSCH Plus and ExpressPCB Plus version 3.0). Highlights of the newly added features include an integrated search and download for components using SnapEDA, schematic link between ExpressSCH Plus and ExpressPCB Plus, as well as netlist validation between the printed circuit board (PCB) layout and the schematic |
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Taiwan’s NTHU Develops a Robot with a Human-hand-like Movement (2021.02.08)
HSINCHU, Taiwan - Although widely used in manufacturing, robots require much more agility for use in nursing and rehabilitation. With this in mind, an interdisciplinary research team led by Professor James Chang of the Department of Power Mechanical Engineering has recently applied the latest advances in AI, biomechanics, and human-factor engineering to develop a robot that can imitate the meticulous movements of a human hand |
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Toshiba Launches 100V High-Current Photorelay for Industrial Equipment (2021.02.08)
Toshiba has launched "TLP241B," a high-current photorelay in a DIP4 package for industrial equipment such as programmable logic controllers and I/O interfaces. Samples and production quantities are available now.
TLP241B has integrated MOSFET based on Toshiba’s latest generation of U-MOS process |
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u-blox ALEX-R5 Integrates Cellular and GNSS into a Miniature SiP form Factor with Zero Compromises (2021.02.03)
u-blox has announced the ALEX-R5, a miniature cellular module that integrates low power wide area (LPWA) connectivity and global navigation satellite system (GNSS) technology into an ultra-small system-in-package (SiP) form factor |
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SnapEDA & Switchcraft Collaborate to Make Electronics Design Faster & More Efficient (2021.01.28)
SnapEDA and Switchcraft are collaborating to distribute digital models for Switchcraft’s products, to help engineers bring new products to life faster.
As the world continues to move at an increasing pace, engineers continue to seek out faster and more efficient ways of realizing their designs |
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TraceParts and SnapEDA Partner to Offer Unified UX to Source Free PCB Footprints (2021.01.20)
TraceParts, one of the world's leading providers of 3D digital content for engineering, and SnapEDA, the creators of the first search engine for electronics design, are announcing a strategic content syndication partnership. The new partnership helps electronics engineers and designers source PCB footprints, schematic symbols, and 3D CAD models at their fingertips, for millions of electronic components |
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PICMG Announces Officers for 2021-2022 Term (2021.01.20)
PICMG, a not-for-profit 501(C) consortium of companies and organizations that collaboratively develop open specifications, held its bi-annual election for officers. The group elected four officers to lead the organization through 2022 |
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Shortage Caused by Explosive Growth in Mini LED Demand to Result in 5-10% Price Hike for LED Chips (2021.01.20)
While major OEMs such as Apple and Samsung prepare to release their new notebook computers, tablets, and TVs that are fully equipped with Mini LED backlights this year, various companies in the LED supply chain began procuring Mini LED chips ahead of time in 4Q20 |
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ST Trims Brushless Motor-Control Designs with Gate-Driver IC Optimized for Low-Voltage Applications (2021.01.20)
STMicroelectronics has created an integrated three-phase half-bridge driver IC with performance optimized for low-voltage industrial applications up to 75V, delivering a space-efficient and power-saving solution to control three-phase brushless motors in e-bikes, power tools, pumps, fans, light machinery, gaming consoles, and other equipment |
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MediaTek Launches 6nm Dimensity 1200 Flagship 5G SoC (2021.01.20)
HSINCHU, Taiwan – MediaTek today unveiled its new Dimensity 1200 and Dimensity 1100 5G smartphone chipsets with unrivaled AI, camera and multimedia features for powerful 5G experiences. The addition of the 6nm Dimensity 1200 and 1100 chipsets to MediaTek’s 5G portfolio gives device makers a growing suite of options to design highly capable 5G smartphones with top of the line camera features, graphics, connectivity enhancements and more |
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Renesas Launches New General-Purpose 64-Bit RZ/G2L Group of MPUs (2021.01.20)
Renesas Electronics announced the expansion of its RZ/G2 general-purpose 64-bit microprocessors (MPUs), delivering improved AI processing for a wide range of applications. The expanded product lineup includes three new entry-level MPU models built around the latest Arm Cortex-A55 core: The RZ/G2L, RZ/G2LC, and RZ/G2UL |
IETF is the Internet Engineering Task Force (International Network Engineering Research Team) is an open international organization, its role is to bring together a network designer, network operators, network vendors, and researchers jointly developed to improve network engineeringarchitecture and build a stable network environment.