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TSMC Unveils 6-nm Process with Direct Migration from N7-based Designs (2019.04.16)
HSINCHU, Taiwan –TSMC today announced its 6-nanometer (N6) process, which provides a significant enhancement of its industry-leading N7 technology and offers customers a highly competitive performance-to-cost advantage as well as fast time-to-market with direct migration from N7-based designs |
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Samsung Successfully Completes 5nm EUV Development (2019.04.16)
Samsung Electronics today announced that its 5-nanometer (nm) FinFET process technology is complete in its development and is now ready for customers’ samples. By adding another cutting-edge node to its extreme ultraviolet (EUV)-based process offerings, Samsung is proving once again its leadership in the advanced foundry market |
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Samsung Successfully Completes 5nm EUV Development (2019.04.16)
Samsung Electronics today announced that its 5-nanometer (nm) FinFET process technology is complete in its development and is now ready for customers’ samples. By adding another cutting-edge node to its extreme ultraviolet (EUV)-based process offerings, Samsung is proving once again its leadership in the advanced foundry market |
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2018 Global Semiconductor Equipment Sales Jump to Record $64.5 Billion (2019.04.11)
Worldwide sales of semiconductor manufacturing equipment surged 14 percent from $56.62 billion in 2017 to an all-time high of $64.5 billion in 2018, SEMI, the industry association representing the worldwide electronics product design and manufacturing supply chain, reported today |
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2018 Global Semiconductor Equipment Sales Jump to Record $64.5 Billion (2019.04.11)
Worldwide sales of semiconductor manufacturing equipment surged 14 percent from $56.62 billion in 2017 to an all-time high of $64.5 billion in 2018, SEMI, the industry association representing the worldwide electronics product design and manufacturing supply chain, reported today |
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Sony Easily Maintains Its Top Ranking in the Diverse O-S-D Market (2019.04.11)
IC Insights noted that only four of the top-10 companies sell products in all three O-S-D market segments. The 10 largest suppliers in the ranking accounted for 39% of combined worldwide O-S-D revenues in 2018, which is the same percentage as in 2017 (in contrast, the top-10 IC suppliers held a 70% share of the total IC market in 2018) |
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Sony Easily Maintains Its Top Ranking in the Diverse O-S-D Market (2019.04.11)
IC Insights noted that only four of the top-10 companies sell products in all three O-S-D market segments. The 10 largest suppliers in the ranking accounted for 39% of combined worldwide O-S-D revenues in 2018, which is the same percentage as in 2017 (in contrast, the top-10 IC suppliers held a 70% share of the total IC market in 2018) |
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Vishay Intertechnology Launches Industry's First AEC-Q200 Qualified Ceramic Disc Capacitors (2019.03.26)
Vishay Intertechnology introduced a new series of Automotive Grade AC line rated ceramic disc safety capacitors that are the industry's first such devices to offer AEC-Q200 qualification for Class X1 (760 VAC) / Y1 (500 VAC) applications in accordance with IEC 60384-14 |
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Vishay Intertechnology Launches Industry's First AEC-Q200 Qualified Ceramic Disc Capacitors (2019.03.26)
Vishay Intertechnology introduced a new series of Automotive Grade AC line rated ceramic disc safety capacitors that are the industry's first such devices to offer AEC-Q200 qualification for Class X1 (760 VAC) / Y1 (500 VAC) applications in accordance with IEC 60384-14 |
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Taiwan Intellectual Property Court Finds Gudeng Precision Infringes Entegris' Reticle Pod Patent (2019.03.25)
Entegris received an oral judgement on March 22, from the Taiwan Intellectual Property Court finding that Gudeng Precision Industrial Co., Ltd. infringes Entegris’ Taiwan Patent No. I-317967. The judgement against Gudeng awarded Entegris NT$978,869,835 (US $32 |
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Taiwan Intellectual Property Court Finds Gudeng Precision Infringes Entegris' Reticle Pod Patent (2019.03.25)
Entegris received an oral judgement on March 22, from the Taiwan Intellectual Property Court finding that Gudeng Precision Industrial Co., Ltd. infringes Entegris’ Taiwan Patent No. I-317967. The judgement against Gudeng awarded Entegris NT$978,869,835 (US $32 |
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TSMC Expected to Reach 48.1% Market Share, Says TrendForce (2019.03.19)
According to TrendForce's newest research report, development momentum of advanced production processes has been dropping due to weakening demand in most end markets, including smartphones. Foundries face a severe challenge in 1Q19, and global foundry production revenue for the first quarter is expected to decline by around 16% compared to the same quarter 2018, arriving at 14 |
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TSMC Expected to Reach 48.1% Market Share, Says TrendForce (2019.03.19)
According to TrendForce's newest research report, development momentum of advanced production processes has been dropping due to weakening demand in most end markets, including smartphones. Foundries face a severe challenge in 1Q19, and global foundry production revenue for the first quarter is expected to decline by around 16% compared to the same quarter 2018, arriving at 14 |
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TSIA Q4 2018 and Year 2018 Statistics on Taiwan IC Industry (2019.02.25)
The TSIA survey showed that Q4 2018 Taiwan IC revenue as a whole (including design, manufacturing, packaging and testing) totaled NT$687.0 billion(US$22.7B) (down 0.7% on-quarter and 1.7% increase on-year).
Separately, with NT$164 |
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TSIA Q4 2018 and Year 2018 Statistics on Taiwan IC Industry (2019.02.25)
The TSIA survey showed that Q4 2018 Taiwan IC revenue as a whole (including design, manufacturing, packaging and testing) totaled NT$687.0 billion(US$22.7B) (down 0.7% on-quarter and 1.7% increase on-year).
(圖一)
Separately, with NT$164 |
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eMemory Receives ISSCC Award for Breakthrough Security Technology (2019.02.19)
HISNCHU, Taiwan – eMemory’s chip-embedded security IP received the Takuo Sugano Award for Outstanding Far-East Paper at the International Solid-State Circuits Conference (ISSCC).
The company received the honor at the flagship conference of the IEEE Solid-State Circuits Society February 18th in San Francisco for its paper “A PUF Scheme Using Competing Oxide Rupture with Bit Error Rate Approaching Zero” |
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eMemory Receives ISSCC Award for Breakthrough Security Technology (2019.02.19)
HISNCHU, Taiwan – eMemory’s chip-embedded security IP received the Takuo Sugano Award for Outstanding Far-East Paper at the International Solid-State Circuits Conference (ISSCC).
The company received the honor at the flagship conference of the IEEE Solid-State Circuits Society February 18th in San Francisco for its paper “A PUF Scheme Using Competing Oxide Rupture with Bit Error Rate Approaching Zero” |
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China IC Production Forecast to Show a Strong 15% 2018-2023 CAGR (2019.02.11)
China has been the largest consuming country for ICs since 2005, but large increases in IC production within China have not immediately followed, according to data presented in the new 500-page 2019 edition of IC Insights’ McClean Report—A Complete Analysis and Forecast of the Integrated Circuit Industry (released in January 2019) |
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China IC Production Forecast to Show a Strong 15% 2018-2023 CAGR (2019.02.11)
China has been the largest consuming country for ICs since 2005, but large increases in IC production within China have not immediately followed, according to data presented in the new 500-page 2019 edition of IC Insights’ McClean Report—A Complete Analysis and Forecast of the Integrated Circuit Industry (released in January 2019) |
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NARLabs Taiwan Semiconductor Research Institute Officially Open (2019.01.31)
TAIPEI, Taiwan - NARLabs Taiwan Semiconductor Research Institute on January 30 was formally unveiled as the world’s only national science and technology research and development center which integrates integrated circuit design, chip offline manufacturing, and semiconductor component manufacturing process research |
USB2.0 is a Universal Serial Bus standard PC and peripheral equipment is widely used to get rid of the application areas limited to the PC in the past, and more in-depth applications in the digital consumer electronics products which.