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TSMC 3-nm Fab Environmental Assessment Approved, to Commence in 2020 (2018.12.20)
TAIPEI, Taiwan - Taiwan's Environmental Administration yesterday approved the environmental assessment for Taiwan Semiconductor Manufacturing Company, Limited's (TSMC) 3-nanometer factory, signifying that TSMC's 3-nm factory will be able to commence operations on schedule in 2020 with total investment amounting to NT $600 billion |
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eMemory’s Reprogrammable NeoMTP Qualified on GLOBALFOUNDRIES’ 130nm BCDLite and BCD Technology (2018.12.17)
HSINCHU, Taiwan–eMemory today announced that its NeoMTP, Multiple-Times-Programmable embedded non-volatile memory (NVM) IP, has been qualified on GLOBALFOUNDRIES (GF) 130nm BCDLite and BCD process technology platforms targeting both consumer power management and automotive AEC-Q100 Grade-1 compliant applications |
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eMemory’s Reprogrammable NeoMTP Qualified on GLOBALFOUNDRIES’ 130nm BCDLite and BCD Technology (2018.12.17)
HSINCHU, Taiwan–eMemory today announced that its NeoMTP, Multiple-Times-Programmable embedded non-volatile memory (NVM) IP, has been qualified on GLOBALFOUNDRIES (GF) 130nm BCDLite and BCD process technology platforms targeting both consumer power management and automotive AEC-Q100 Grade-1 compliant applications |
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Faraday Reveals Its Multi-protocol Video Interface IP on UMC 28HPC (2018.12.11)
HSINCHU, Taiwan - Faraday Technology today announced the availability of its multi-protocol video interface IP on UMC 28nm HPC. The solution supports both transmitter (TX) and receiver (RX) featuring a reduced silicon footprint ideal for state-of-the-art panel and sensor interfaces, projectors, MFP, DSC, surveillance, AR and VR, and AI applications |
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Faraday Reveals Its Multi-protocol Video Interface IP on UMC 28HPC (2018.12.11)
HSINCHU, Taiwan - Faraday Technology today announced the availability of its multi-protocol video interface IP on UMC 28nm HPC. The solution supports both transmitter (TX) and receiver (RX) featuring a reduced silicon footprint ideal for state-of-the-art panel and sensor interfaces, projectors, MFP, DSC, surveillance, AR and VR, and AI applications |
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TSMC to Build a New 200mm Fab for Customized Design; 5-nm to Enter Trial Production Next Year (2018.12.07)
TAIPEI, Taiwan - C.C. Wei, CEO and vice chairman of TSMC, said at its supply chain management forum held in Hsinchu, Taiwan, that TSMC's 5nm process is expected to enter trial production in the second quarter of next year. In addition, TSMC will establish a new 8-inch(200mm) fab to meet the requirements of the customized design |
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TSMC to Build a New 200mm Fab for Customized Design; 5-nm to Enter Trial Production Next Year (2018.12.07)
TAIPEI, Taiwan - C.C. Wei, CEO and vice chairman of TSMC, said at its supply chain management forum held in Hsinchu, Taiwan, that TSMC's 5nm process is expected to enter trial production in the second quarter of next year. In addition, TSMC will establish a new 8-inch(200mm) fab to meet the requirements of the customized design |
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TSIA: AI Will Drive Continual Prosperous Development of Taiwan’s IC Industry (2018.11.28)
HSINCHU, Taiwan - Taiwan Semiconductor Industry Association (TSIA) in Hsinchu held the 2018 Taiwan Semiconductor Industry Convention, which was hosted by Taiwan Semiconductor Manufacturing Company Limited (TSMC) CEO and Vice Chairman C |
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TSIA: AI Will Drive Continual Prosperous Development of Taiwan’s IC Industry (2018.11.28)
HSINCHU, Taiwan - Taiwan Semiconductor Industry Association (TSIA) in Hsinchu held the 2018 Taiwan Semiconductor Industry Convention, which was hosted by Taiwan Semiconductor Manufacturing Company Limited (TSMC) CEO and Vice Chairman C |
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IC Insights Announces Top-15 2018 Semi Suppliers Forecast; Samsung Ranks NO.1 (2018.11.13)
IC Insights today released its forecast of top-15 worldwide semiconductor (IC and O-S-D—optoelectronic, sensor, and discrete) sales ranking for 2018. It includes seven suppliers headquartered in the U.S., three in Europe, two each in South Korea and Japan, and one in Taiwan |
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IC Insights Announces Top-15 2018 Semi Suppliers Forecast; Samsung Ranks NO.1 (2018.11.13)
IC Insights today released its forecast of top-15 worldwide semiconductor (IC and O-S-D—optoelectronic, sensor, and discrete) sales ranking for 2018. It includes seven suppliers headquartered in the U.S., three in Europe, two each in South Korea and Japan, and one in Taiwan |
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IC Insights: Quarterly YoY Growth Slows Substantially for IC Market (2018.11.02)
IC Insights pointed that IC market is expected to enter a period of cyclical “cooling” after an extended period of very strong growth.
Figure illustrates the worldwide quarterly year-over-year IC market increases from 1Q through 3Q and IC Insights’ forecast for 4Q of this year |
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IC Insights: Quarterly YoY Growth Slows Substantially for IC Market (2018.11.02)
IC Insights pointed that IC market is expected to enter a period of cyclical “cooling” after an extended period of very strong growth.
(圖一)
Figure illustrates the worldwide quarterly year-over-year IC market increases from 1Q through 3Q and IC Insights’ forecast for 4Q of this year |
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Samsung Electronics Starts Production of EUV-Based 7nm LPP Process (2018.10.18)
Samsung Electronics today announced that it has completed all process technology development and has started wafer production of its revolutionary process node, 7LPP, the 7-nanometer (nm) LPP (Low Power Plus) with extreme ultraviolet (EUV) lithography technology |
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Samsung Electronics Starts Production of EUV-Based 7nm LPP Process (2018.10.18)
Samsung Electronics today announced that it has completed all process technology development and has started wafer production of its revolutionary process node, 7LPP, the 7-nanometer (nm) LPP (Low Power Plus) with extreme ultraviolet (EUV) lithography technology |
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M31 Technology’s Diversified TSMC 28HPC+ ULL Memory Compilers (2018.10.02)
HSINCHU, Taiwan - M31 Technology today announced that it has developed a diversified TSMC 28HPC + Ultra-Low Power (ULL) Memory Compiler IP portfolio that provides customers with more flexibility in their SoC design.
“TSMC’s 28HPC+ ULL memory bit-cell provides further leakage reduction for mainstream smart phones |
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M31 Technology’s Diversified TSMC 28HPC+ ULL Memory Compilers (2018.10.02)
HSINCHU, Taiwan - M31 Technology today announced that it has developed a diversified TSMC 28HPC + Ultra-Low Power (ULL) Memory Compiler IP portfolio that provides customers with more flexibility in their SoC design.
“TSMC’s 28HPC+ ULL memory bit-cell provides further leakage reduction for mainstream smart phones |
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China Forecast to Account for 90% of Pure-Play Foundry Market Growth in 2018 (2018.09.27)
IC Insights’ September Update to The McClean Report shows that as a result of a 51% forecasted increase in the China pure-play foundry market this year, China’s total share of the 2018 pure-play foundry market is expected to jump by five percentage points to 19%, exceeding the share held by the rest of the Asia-Pacific region |
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China Forecast to Account for 90% of Pure-Play Foundry Market Growth in 2018 (2018.09.27)
IC Insights’ September Update to The McClean Report shows that as a result of a 51% forecasted increase in the China pure-play foundry market this year, China’s total share of the 2018 pure-play foundry market is expected to jump by five percentage points to 19%, exceeding the share held by the rest of the Asia-Pacific region |
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M31 MIPI M-PHY Certified with ASIL-B Safety Level of ISO 26262 (2018.09.27)
TAIWAN, Hsinchu – M31 Technology Corporation announced today that its MIPI M-PHY Gear3 IP has been certified with the ASIL B safety level of ISO 26262 and will be used by international first-class automotive electronics manufacturers to provide safe and reliable automotive SoC design |
