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Imec Ramps Up the Development of the High-NA EUV Patterning Ecosystem (2022.05.03)
LEUVEN,Belgium— At the 2022 SPIE Advanced Lithography and Patterning Conference, imec presents significant progress in preparing the High-NA patterning ecosystem for the imec-ASML Joint High-NA Lab, which will be centered around the first 0 |
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Pulsonix PCB Design Adds 3D Collision Detection (2022.04.21)
Tewkesbury, UK– Pulsonix Announces the release of Pulsonix version 12.0, which adds new capabilities, speed improvements, and requested usability enhancements.
“Version 12.0 offers a significant step up for our users in the areas of the PCB design process that they say would benefit them the most, ” said Bob Williams, marketing director for Pulsonix |
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Avalue Launches 3-in-1 M.2 Expansion Card (2022.04.21)
TAIPEI, TAIWAN–Avalue Technology Launches latest peripheral product EPM-1607 with PCIe 3-in-1 M.2 2280/2260/2242 may be split according to requirements, can expand four independent RS-232 serial ports, and ultra-low power consumption |
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Phison Held opening ceremony of the affiliated parking space (2022.04.09)
Phison Electronics held the opening ceremony of the affiliated parking tower of Phison R&D Building on Apr, 8 (Taipei time). This parking tower not only achieves the goal of all Phison employees having a parking space, but also becomes a new welfare indicator for Guangyuan Science Park (廣源科學園區) in Zhunan, Miaoli |
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Kioxia Introduces 2nd Generation SSDs Designed With PCIe 5.0 (2022.03.24)
The first vendor to offer a drive designed with PCIe 5.0 interface technology, Kioxia Corporation announced that it has built on this achievement by introducing its 2nd generation SSDs.
The company’s new KIOXIA CD8 Series data center NVMe SSDs (“CD8 Series”) are optimized for hyperscale data center and enterprise server-attached workloads, and utilize PCIe 5 |
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Phison Electronics Passes ISO 26262 Certification (2022.03.12)
San Jose, Calif- Phison Electronics Corp Announces that it has passed the automotive functional safety development process certification, ISO 26262.
The automotive storage market has always been a major growth driver for the NAND storage manufacturers |
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ICInsight:2022 to Mark 20% Growth for the Foundry Market (2022.03.12)
IC Insights’ Forecast for the foundry market through 2026 was part of its recently released 1Q Update to the 2022 McClean Report. The Update also included analyses of the top-25 2021 semiconductor suppliers, semiconductor industry capital spending, IC industry capacity, the automotive IC market, and detailed forecasts for the DRAM, flash, MCU, MPU, and analog IC product segments |
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Takisawa Smart Factory Show Hi-Efficiency and Hi-Precision Machines (2022.02.24)
TAIPEI, Taiwan - Affected by global shipment traffic and lacking of raw material, this year in TIMTOS x TMTS 2022 is more focused on high efficiency multi-function machine design. Under this environment, Taiwan Takisawa also focus on developing high efficiency machine, plus smart production line and modulization of parts, which is more economical and time saving, all disclosed in this year TIMTOS x TMTS on booth J0118 |
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HOLTEK New BP66FW1242 Wireless Charger Rx MCU (2022.02.17)
Holtek announced the release of its new WPC Qi certified, sub-5W wireless charger receiver MCU, the BP66FW1242. The device conforms to the Qi communication protocol and includes an integrated linear wireless charger.
Together with other rich peripheral resources, the devices provides functions for wireless charging, lithium battery charging and discharging management and product system control |
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ICInsights:Semiconductor Sales To Rise at 7.1% CAGR Through 2026 (2022.02.14)
IC Insights has released its forecast and analysis of the worldwide semiconductor industry in its January Semiconductor Industry Flash Report—part of the 2022 McClean Report service.
The report forecasts total semiconductor sales will rise 11% this year following a very strong 25% increase in 2021 and an 11% increase in 2020 |
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Easier Access to Market’s Best High Precision GNSS Positioning Performance (2021.12.06)
u-blox has announced a suite of products and feature additions that simplify access to reliable centimeter-level positioning accuracies for the industrial navigation and robotics markets. The upgraded ZED-F9P high precision g |
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congatec, SYSGO Join Forces to Meet Functional Safety and Security of Computer-on-Modules (2021.11.17)
congatec announces its strategic partnership with SYSGO, Europe’s number one provider of real-time operating systems for safety and cybersecurity applications. The goal is to provide the critical systems markets – such as industrial automation |
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NaviBlind Leverages u-blox's GNSS to Empower the Blind and Visually Impaired (2021.11.09)
u-blox today announced that NaviBlind, a technology provider delivering independent, safe, and flexible navigation to blind and visually impaired users has integrated the u-blox ZED-F9P high precision module into their GNSS solution paired to the NaviBlind app |
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Apple Joins in imec's Program to Reduce Ecological Footprint of Semiconductor (2021.11.03)
Imec announced that Apple Inc. has joined imec’s brand-new Sustainable Semiconductor Technologies and Systems (SSTS) research program. The SSTS program is the first initiative rallying stakeholders from across the IC value chain to anticipate the environmental impact of choices made at chip technology’s definition phase |
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AUO Teams Up with ADLINK to Envision Visualization at the Edge (2021.11.02)
HSINCHU, Taiwan – Today, AUO and ADLINK jointly held their first ever virtual technology forum themed “Visualization at the Edge” to share the industry trends and applications of the visualization of edge computing and jointly increase the possibilities of complementing, collaboration, and co-creation with global ecosystem partners in the hope of accelerating key decision-making at the edge and realizing the future with 5G and AI |
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Bird Debuts Smart Sidewalk Protection with u-blox (2021.11.02)
Bird, the leader in environmentally friendly electric transportation, today announced the first-of-its-kind smart sidewalk protection technology - a sensor fusion solution - designed and developed in partnership with u-blox, which is integrated into Bird’s vehicles, is designed to prevent micromobility devices from being used on sidewalks and footpaths |
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DRAM Prices Projected to Enter Period of Downswing in 2022, Says TrendForce (2021.10.12)
DRAM contract prices are likely to exit a bullish period that lasted three quarters and be on the downswing in 4Q21 at a QoQ decline of 3-8%, according to TrendForce’s latest investigations.
This decline can be attributed to not only the declining procurement activities of DRAM buyers going forward, but also the drop in DRAM spot prices ahead of contract prices |
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Samsung Starts Mass Production of 14nm EUV DDR5 DRAM (2021.10.12)
Samsung Electronics today announced that it has begun mass producing the industry's smallest, 14-nanometer (nm), DRAM based on extreme ultraviolet (EUV) technology. Following the company’s shipment of the industry-first EUV DRAM in March of last year, Samsung has increased the number of EUV layers to five to deliver today’s finest, most advanced DRAM process for its DDR5 solutions |
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Phison Practicing ESG and Carbon Reduction by Purchasing Green Power (2021.10.11)
Phison Electronics has made continuous efforts to implement ESG and green supply chain, and signed a ten-year green power purchase agreement with Foxwell Power, committed to energy conservation, carbon reduction and sustainable development of the earth |
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HOLTEK New HT45F0059 Low Power Continuous Heating Induction Cooker MCU (2021.10.11)
With a focus in the induction cooker application area, Holtek announces the release of its new low power continuous heating induction cooker Flash MCU, the HT45F0059.
This low power device ensures that induction cookers can generate a uniform and efficient heating source |
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