從2D系統晶片到3D系統整合

從2D系統晶片到3D系統整合
閱覽人次:4156

【課程簡介】：
行動世代的晶片設計要求低功率、高性能與輕薄短小的極致，因此行動應用之需求成為持續推動摩爾定律(Moore’s Law)之主要力量。然而在元件物理上與經濟上遇到的障礙將無可避免的減緩其進展，甚或終將停滯不進，因此，後摩爾定律時代來臨之前，極需有革命性的新技術出現，以延續產業之發展。而在各種新技術之中，3DIC矽穿孔堆疊技術已被視為最有希望之明日之星，挾其高性能、低耗電、微尺寸與異質整合特性，強調輕薄短小與電池續航力之各種行動裝置將首先受惠。而台灣垂直分工的產業特性也將不可避免地遭遇新挑戰，如能成功突破，另一個新興兆元產業的願景將不是夢。

【講師簡歷】：

顧子琨組長
顧子琨博士目前任職於工研院電光所，主要負責材料與製程開發研究，現為「台灣3DS-IC標準委員會」的主席之一，負責台灣3DIC技術的推動。 Tzu Kun Ku got his Electronic Engineering Ph.D degree of National Chao-Tung University at 1996. He was working in semiconductor technology R&D more than 14 years. He had 27 international papers published and 8 patents granted. After his graduation, he enter the ITRI’s Electrical Research & Service Organization (ERSO) as a R&D engineer for deep submicron semiconductor process technology development from 1996-2000. In this period, he had developed the sub 0.13um backend technologies including both Al/low-k metallization and Cu/low-k dual damascene technology. After 2000, he joined the Technology Development Division of Silicon Integrated System (SiS) company. In the three years staying in SiS, he in charged the integration team to successfully developed 0.15um high speed Logic, low power, RFCMOS & Mixed signal, 90nm logic device and advanced dual damascene Cu/low-k BEOL process integration technologies. From 2003 May to 2010 Apr., he joined a startup highend GPU products design house XGI (eXtreme Graphic Innovation) as an engineering director. He was in charged three different departments including product engineering/testing, QA and system engineering. In 2010 April, he decided to back ITRI and acts as Nanoelectronic technology division director of EOL. His currently major interest and responsibility of EOL is to develop the “More than Morre” semiconductor technologies including emerging TSV based 3DIC technology, new non-volatile memory technology and next generation high power devices.